Safe Handling of Cannulas and Needles in Chemistry Laboratories

Journal of Chemical Health and Safety ◽

10.1021/acs.chas.1c00069 ◽

2022 ◽

Author(s):

Tilak Chandra ◽

Jeffrey P. Zebrowski ◽

Lisa Y. Lenertz

Keyword(s):

Safe Handling ◽

Chemistry Laboratories

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Risk Perception In Chemistry Laboratories Among Undergraduate Students

PsycEXTRA Dataset ◽

10.1037/e509522017-001 ◽

2017 ◽

Author(s):

Luz S. Marin ◽

Mariona Portell ◽

Clara Rosalia Alvarez ◽

Francisca Munoz ◽

Luis Velazquez

Keyword(s):

Risk Perception ◽

Undergraduate Students ◽

Chemistry Laboratories

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A program for generating method descriptions and bibliographies of routine work performed in analytical chemistry laboratories

Open-File Report ◽

10.3133/ofr931c ◽

1993 ◽

Author(s):

J.N. Grossman ◽

M.W. Doughten

Keyword(s):

Analytical Chemistry ◽

Generating Method ◽

Routine Work ◽

Chemistry Laboratories

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A Novel Approach to Front-Side Deprocessing for Thinned Die after Backside Failure Isolation

ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2003p0105 ◽

2003 ◽

Author(s):

Dat Nguyen ◽

Cuong Phan ◽

Jeff Conner ◽

Martin Smith ◽

John Drummond

Keyword(s):

Front Side ◽

Ball Grid Arrays ◽

Safe Handling ◽

Flip Chips ◽

Novel Approach ◽

Diamond Saw ◽

Reconstructed Sample

Abstract This paper describes a novel approach for safe handling of the thinned die from the front; a technique that can also be successfully applied to preserve cracked die. The discussion provides details on the characteristics and processes involved in backside reconstruction, thinned die reconstruction, and front-side deprocessing of thinned die. The finished backside reconstruction sample was cross-sectioned for examination using a diamond saw. After 6 hours of bake, no cracking of the thinned die was observed. Front-side deprocessing was then applied to the backside reconstructed sample. The sample remains intact. The technique has proven to be easily applied and highly reliable, and provides a solution for front-side deprocessing for both high pin count ball grid arrays and flip chips.

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