Thermally-coupled IC interconnect networks

Author(s):  
Andrew Labun
2010 ◽  
Vol 87 (3) ◽  
pp. 321-323 ◽  
Author(s):  
M. Gallitre ◽  
A. Farcy ◽  
B. Blampey ◽  
C. Bermond ◽  
B. Fléchet ◽  
...  

Author(s):  
D.C. Sekar ◽  
R. Venkatesan ◽  
K.A. Bowman ◽  
A. Joshi ◽  
J.A. Davis ◽  
...  

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