Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

2007 ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Heat Conduction ◽  
Printed Circuit Boards ◽  
Mesoscale Modeling ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Modeling Approach

1911 Heat Conduction in Printed Circuit Boards-Part I : Overview and the Case of a JEDEC Test Board

2007 ◽  
Vol 2007.7 (0) ◽  
pp. 189-190
Author(s):  
Wataru NAKAYAMA ◽  
Tatsuya NAKAJIMA ◽  
Hiroko KOIKE ◽  
Ryuichi MATSUKI
Keyword(s):  
Heat Conduction ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Test Board

scholarly journals Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

2016 ◽  
Vol 9 (6) ◽  
pp. 2053-2062 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor ◽  
F. Che Ani ◽  
N.H. Adam ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Cfd Modeling ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Wave Soldering ◽  
Modeling Approach ◽  
Effects Of Temperature

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit
Sign in / Sign up

Export Citation Format

Share Document