I122 Heat transfer characteristics of porous heat sink for high heat flux removal

2012 ◽  
Vol 2012 (0) ◽  
pp. 271-272
Author(s):  
Kazuhisa Yuki ◽  
Koichi Suzuki
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics

High heat flux flow boiling in silicon multi-microchannels – Part I: Heat transfer characteristics of refrigerant R236fa

2008 ◽  
Vol 51 (21-22) ◽  
pp. 5400-5414 ◽  
Author(s):  
Bruno Agostini ◽  
John Richard Thome ◽  
Matteo Fabbri ◽  
Bruno Michel ◽  
Daniele Calmi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Transfer Characteristics ◽  
Flux Flow ◽  
Transfer Characteristics

High heat flux flow boiling in silicon multi-microchannels – Part II: Heat transfer characteristics of refrigerant R245fa

2008 ◽  
Vol 51 (21-22) ◽  
pp. 5415-5425 ◽  
Author(s):  
Bruno Agostini ◽  
John Richard Thome ◽  
Matteo Fabbri ◽  
Bruno Michel ◽  
Daniele Calmi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Transfer Characteristics ◽  
Flux Flow ◽  
Transfer Characteristics

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

2006 ◽  
Vol 129 (3) ◽  
pp. 247-255 ◽  
Author(s):  
X. L. Xie ◽  
W. Q. Tao ◽  
Y. L. He
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Wall Thickness ◽  
Heat Sink ◽  
Channel Wall ◽  
High Heat ◽  
Coolant Fluid ◽  
High Heat Flux ◽  
It Industry

With the rapid development of the Information Technology (IT) industry, the heat flux in integrated circuit (IC) chips cooled by air has almost reached its limit at about 100W∕cm2. Some applications in high technology industries require heat fluxes well beyond such a limitation. Therefore, the search for a more efficient cooling technology becomes one of the bottleneck problems of the further development of the IT industry. The microchannel flow geometry offers a large surface area of heat transfer and a high convective heat transfer coefficient. However, it has been hard to implement because of its very high pressure head required to pump the coolant fluid through the channels. A normal channel size could not give high heat flux, although the pressure drop is very small. A minichannel can be used in a heat sink with quite a high heat flux and a mild pressure loss. A minichannel heat sink with bottom size of 20mm×20mm is analyzed numerically for the single-phase turbulent flow of water as a coolant through small hydraulic diameters. A constant heat flux boundary condition is assumed. The effect of channel dimensions, channel wall thickness, bottom thickness, and inlet velocity on the pressure drop, temperature difference, and maximum allowable heat flux are presented. The results indicate that a narrow and deep channel with thin bottom thickness and relatively thin channel wall thickness results in improved heat transfer performance with a relatively high but acceptable pressure drop. A nearly optimized structure of heat sink is found that can cool a chip with heat flux of 350W∕cm2 at a pumping power of 0.314W.

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