06/00796 Two-phase flow in high-heat-flux micro-channel heat sink for refrigeration cooling applications: Part II — heat transfer characteristics

2006 ◽  
Vol 47 (2) ◽  
pp. 118
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Two Phase Flow ◽  
High Heat ◽  
High Heat Flux ◽  
Phase Flow ◽  
Micro Channel ◽  
Heat Transfer Characteristics ◽  
Two Phase

scholarly journals Experimental Investigation of Non-Uniform Heating on Flow Boiling Instabilities in a Microchannels Based Heat Sink

2009 ◽  
Author(s):  
D. Bogojevic ◽  
K. Sefiane ◽  
A. J. Walton ◽  
H. Lin ◽  
G. Cummins ◽  
...  
Keyword(s):  
Heat Sink ◽  
Two Phase Flow ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Phase Flow ◽  
Central Processor ◽  
Back Side ◽  
Uniform Heating ◽  
Two Phase

Two-phase flow boiling in microchannels is one of the most promising cooling technologies able to cope with high heat fluxes generated by the next generation of central processor units (CPU). If flow boiling is to be used as a thermal management method for high heat flux electronics it is necessary to understand the behaviour of a non-uniform heat distribution, which is typically the case observed in a real operating CPU. The work presented is an experimental study of two-phase boiling in a multi-channel silicon heat sink with non-uniform heating, using water as a cooling liquid. Thin nickel film sensors, integrated on the back side of the heat sinks were used in order to gain insight related to temperature fluctuations caused by two-phase flow instabilities under non-uniform heating. The effect of various hotspot locations on the temperature profile and pressure drop has been investigated, with hotspots located in different positions along the heat sink. It was observed that boiling inside microchannels with non-uniform heating led to high temperature non-uniformity in transverse direction.

State of the Art of Electronics Cooling for Radar Antenna Applications

2017 ◽  
Author(s):  
Girish Upadhya ◽  
Clayton Pullins ◽  
Karl Freitag ◽  
George Hall ◽  
James Marthinuss
Keyword(s):  
Heat Flux ◽  
Two Phase Flow ◽  
Electronic Device ◽  
High Heat ◽  
Thermal Design ◽  
High Heat Flux ◽  
Phase Flow ◽  
Two Phase ◽  
Modeling Tools ◽  
Radar Antenna

High heat flux from electronic devices remains a continuing challenge for cooling of electronics hardware in radar antenna applications pertaining to the defense industry. Cooling methods for such applications have varied from conduction cooling approaches for the cooling of circuit card assemblies, to advanced convection cooling using two phase flow (with pumped refrigerant) for the high heat flux devices used in transmit / receive modules. It is found that the limiting parameter in such applications is usually the heat flux from the electronic device. This paper provides an overview of the cooling techniques used for defense electronics, as well as current modeling tools and analytical methods used for thermal design during the product development phase. The role of thermal interface materials used in the material stack up for the thermal design solutions will also be touched upon. Additionally, the importance of using experimental techniques to characterize the heat transfer coefficient for the pumped refrigerant two phase flow will be discussed.

A Review of High-Heat-Flux Heat Removal Technologies

2011 ◽  
Vol 133 (11) ◽  
Author(s):  
M. A. Ebadian ◽  
C. X. Lin
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Heat Removal ◽  
High Heat ◽  
High Heat Flux ◽  
Phase Flow ◽  
Two Phase ◽  
Recent Developments ◽  
Removal Technologies

In recent years, high-heat-flux cooling techniques have received great attention from researchers around the world due to its importance in thermal management of both commercial and defense high-power electronic devices. Although impressive progress has been made during the last few decades, high-heat-flux removal still largely remains as a challenging subject that needs further exploration and study. In this paper, we have reviewed recent developments in several high-heat-flux heat removal techniques, including microchannels, jet impingements, sprays, wettability effects, and piezoelectrically driven droplets. High-heat-flux removal can be achieved effectively by either single-phase flow or two-phase flow boiling heat transfer. Better understandings of the underlying heat transfer mechanisms for performance improvement are discussed.

Sign in / Sign up

Export Citation Format

Share Document