THERMAL STRESS TESTING OF SM-2 FUEL ELEMENTS. Final Report for January 1, 1959 to July 1, 1960

Mapping Intimacies ◽

10.2172/4153294 ◽

1960 ◽

Author(s):

J.A. Christenson ◽

J.D. Kortheuer

Keyword(s):

Thermal Stress ◽

Stress Testing ◽

Final Report ◽

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THERMAL STRESS TESTING OF SM-2 FUEL ELEMENTS. Interim Technical Report for January 1, 1959 to January 1, 1960

10.2172/4179466 ◽

1960 ◽

Author(s):

J.A. Christenson

Keyword(s):

Thermal Stress ◽

Stress Testing ◽

Technical Report ◽

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Thermal Stress Testing of Advanced Optical Ceramics by a Laser Technique

Thermal Stresses in Severe Environments ◽

10.1007/978-1-4613-3156-8_35 ◽

1980 ◽

pp. 553-566 ◽

Author(s):

S. G. Schwille ◽

R. A. Tanzilli ◽

S. Musikant

Keyword(s):

Thermal Stress ◽

Stress Testing ◽

Laser Technique ◽

Optical Ceramics

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Assembly and performance of fuel elements for H-Reactor E-N demonstration load. Final report

10.2172/10145604 ◽

1962 ◽

Author(s):

W. A. Blanton ◽

W. H. Hodgson

Keyword(s):

Final Report ◽

And Performance ◽

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Radiometallurgical examination of self supported fuel elements PT-IP-84-A. Final report

10.2172/10170446 ◽

1960 ◽

Author(s):

R. Teats

Keyword(s):

Final Report ◽

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Irradiation swelling, creep and thermal-stress analysis of LWR fuel elements, computer code isune-2

Nuclear Engineering and Design ◽

10.1016/0029-5493(75)90056-4 ◽

1975 ◽

Vol 34 (3) ◽

pp. 361-378 ◽

Author(s):

Benjamin M. Ma

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Computer Code ◽

Thermal Stress Analysis ◽

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Kadota Fund International Forum 2004. Application of thermal stress for the improvement of health, 15–18 June 2004, Awaji Yumebutai International Conference Center, Awaji Island, Hyogo, Japan. Final Report

International Journal of Hyperthermia ◽

10.1080/02656730701883675 ◽

2008 ◽

Vol 24 (2) ◽

pp. 123-140 ◽

Author(s):

Tsutomu Sugahara ◽

J. Van Der Zee ◽

Harm H. Kampinga ◽

Zeliko Vujaskovic ◽

Motoharu Kondo ◽

...

Keyword(s):

Thermal Stress ◽

Final Report ◽

International Forum ◽

International Conference ◽

Conference Center

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Study of copper barrel plating dissolution of printed circuit board with multiple exposure thermal stress testing

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference ◽

10.1109/impact.2010.5699467 ◽

2010 ◽

Author(s):

Wu Jia-Xiong ◽

Zhang Jin-Fei

Keyword(s):

Thermal Stress ◽

Stress Testing ◽

Printed Circuit Board ◽

Circuit Board ◽

Multiple Exposure ◽

Printed Circuit

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Testing of Zircaloy-2-clad uranium seven-rod fuel elements. Final report

10.2172/10151929 ◽

1960 ◽

Author(s):

G.T. Geering

Keyword(s):

Final Report ◽

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Irradiation testing of tubular fuel elements: PT-IP 292A. Final report

10.2172/10170919 ◽

1961 ◽

Author(s):

G.T. Geering

Keyword(s):

Final Report ◽

Tubular Fuel ◽

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Evaluation of Reliability of Brittle Components by Thermal Stress Testing

Journal of the American Ceramic Society ◽

10.1111/j.1151-2916.1985.tb10143.x ◽

1985 ◽

Vol 68 (7) ◽

pp. 363-367 ◽

Author(s):

D. JOHNSON-WALLS ◽

M. D. DRORY ◽

A. G. EVANS ◽

D. B. MARSHALL ◽

K. T. FABER

Keyword(s):

Thermal Stress ◽

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