2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference
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9781424497836
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Study on paddle delamination for quad flat no leads package

2010 ◽  
Author(s):  
Chen-Hung Lee ◽  
Lu-Fu Lin ◽  
Tsung-Han Ho ◽  
Shi-Shiun Cheng ◽  
Hung-Hsu Tu ◽  
...  

Global outlook for embedded device packaging

2010 ◽  
Author(s):  
Charles E. Bauer ◽  
Herbert J. Neuhaus
Keyword(s):  
Embedded Device

iNEMI HFR-Free Leadership Project report

2010 ◽  
Author(s):  
John Davignon ◽  
Stephen Hall ◽  
David Senk ◽  
Stephen Tisdale
Keyword(s):  
Project Report

Study PBTI and NBTI of GAA-MNC TFTs

2010 ◽  
Author(s):  
Tsung-Kuei Kang ◽  
Chun-Kai Wang ◽  
I-Hsien Tsai ◽  
Ruei-Sheng Hung ◽  
Yun-Feng Chen ◽  
...  

Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad

2010 ◽  
Author(s):  
Hsiang-Chen Hsu ◽  
Chih-Chiang Fu ◽  
Hong-Shen Chang ◽  
Shen-Li Fu ◽  
Huang-Kuang Kung
Keyword(s):  
Thermal Aging ◽  
Copper Wire ◽  
Aging Effect ◽  
Frictional Behavior

Fast DNA hybridization chip using denature and motion of nucleic acids

2010 ◽  
Author(s):  
Yung-Chiang Chung ◽  
Yu-Cheng Lin ◽  
Chaung-Di Chueh ◽  
Chuan-You Ye ◽  
Li-Wei Lai ◽  
...  
Keyword(s):  
Nucleic Acids ◽  
Dna Hybridization

The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation X-ray

2010 ◽  
Author(s):  
Hsueh-Hsien Hsu ◽  
Tao-Chih Chang ◽  
Chih Chen ◽  
Hsin-Yi Lee ◽  
Albert T. Wu
Keyword(s):  
Thermal Stress ◽  
Synchrotron Radiation ◽  
In Situ Measurement ◽  
3D Ic ◽  
X Ray
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