The design of modern electronic devices has been dealing with challenges on thermal control. In this work, it is proposed two different ways of modeling the temperature field in Solid State Electronics (SSE) using integral transforms, with several heat generations in the domain of the microchip and external convection. Two proposed approaches solve the heat conduction formulation on the SSE using the Classical Integral Transform Technique (CITT): One performing a single transformation (CITT-ST) and the other performing a double transformation (CITT-DT). Both methodologies are compared and achieved similar results. The simpler analytical solution by CITT-DT contrasts with a complex and cumbersome analytical manipulation of CITT-ST. The results show that CITT-ST is more efficient to obtain the solution, requiring a lower truncation order, for the problem of heat conduction in Solid State Electronics even though it has a more complex formulation.
COMPARISON BETWEEN SINGLE AND DOUBLE INTEGRAL TRANSFORMATION SOLUTIONS OF HEAT CONDUCTION IN SOLID-STATE ELECTRONICS
