7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

Thermo-Mechanical Modeling of Plastic-Core Solder Balls in LTCC/BGA Assemblies

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1644003 ◽

2006 ◽

Author(s):

J. Anttonen ◽

T. Kangasvieri ◽

O. Nousiainen ◽

J. Putaala ◽

J. Vahakangas

Keyword(s):

Mechanical Modeling ◽

Solder Balls

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Challenges in using nano-textured surfaces to reduce pressure drop through microchannels

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1644071 ◽

2006 ◽

Cited By ~ 1

Author(s):

T. Dalton ◽

M. Hodes ◽

C. Eason ◽

P. Kolodner ◽

R. Enright ◽

...

Keyword(s):

Pressure Drop ◽

Textured Surfaces

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An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental — Numerical Techniques

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1643982 ◽

2006 ◽

Cited By ~ 1

Author(s):

M.Y. Jansen ◽

J.W.C. de Vries ◽

W.D. van Driel

Keyword(s):

Efficient Method ◽

Electronic Packages ◽

Numerical Techniques ◽

Board Level ◽

Board Level Reliability

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Design for Micro & Nano Manufacture — The "PATENT-DfMM Network of Excellence: Modelling & Simulation Cluster

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1644068 ◽

2006 ◽

Author(s):

A. Richardson ◽

O. Slattery ◽

M. Rencz

Keyword(s):

Modelling Simulation

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Adhesion of Arbitrary-Shaped Thin-Film Microstructures

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1643993 ◽

2006 ◽

Author(s):

D. Bhate ◽

M. Dunn

Keyword(s):

Thin Film

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Numerical Identification of Geometric Parameters from Dynamic Measurement of Grinded Membranes on Wafer Level

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1644016 ◽

2006 ◽

Cited By ~ 2

Author(s):

M. Ebert ◽

R. Gerbach ◽

J. Bagdahn ◽

S. Michael ◽

S. Hering

Keyword(s):

Dynamic Measurement ◽

Geometric Parameters ◽

Wafer Level

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Truly Nonlinear Model-Order Reduction Techniques

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1644020 ◽

2006 ◽

Cited By ~ 2

Author(s):

S. Mijalkovic

Keyword(s):

Nonlinear Model ◽

Model Order Reduction ◽

Order Reduction ◽

Model Order ◽

Reduction Techniques

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Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1644011 ◽

2006 ◽

Cited By ~ 2

Author(s):

D. Peyrou ◽

P. Pons ◽

H. Granier ◽

D. Leray ◽

A. Ferrand ◽

...

Keyword(s):

Rf Mems ◽

Mems Switches ◽

Rf Mems Switches

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Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1643998 ◽

2006 ◽

Cited By ~ 1

Author(s):

A. Augustin ◽

T. Hauck ◽

A. Ghazinour

Keyword(s):

Automotive Applications ◽

Thermo Electric ◽

Electric Simulation

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Multi-Physics Modeling and Finite Element Approximation of Charge Flow in Ionic Channels

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ◽

10.1109/esime.2006.1643975 ◽

2006 ◽

Author(s):

B. Chini ◽

J.W. Jerome ◽

R. Sacco

Keyword(s):

Finite Element ◽

Finite Element Approximation ◽

Ionic Channels ◽

Element Approximation ◽

Charge Flow ◽

Physics Modeling

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7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermo-Mechanical Modeling of Plastic-Core Solder Balls in LTCC/BGA Assemblies

Challenges in using nano-textured surfaces to reduce pressure drop through microchannels

An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental — Numerical Techniques

Design for Micro & Nano Manufacture — The "PATENT-DfMM Network of Excellence: Modelling & Simulation Cluster

Adhesion of Arbitrary-Shaped Thin-Film Microstructures

Numerical Identification of Geometric Parameters from Dynamic Measurement of Grinded Membranes on Wafer Level

Truly Nonlinear Model-Order Reduction Techniques

Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations

Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications

Multi-Physics Modeling and Finite Element Approximation of Charge Flow in Ionic Channels

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7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermo-Mechanical Modeling of Plastic-Core Solder Balls in LTCC/BGA Assemblies

Challenges in using nano-textured surfaces to reduce pressure drop through microchannels

An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental — Numerical Techniques

Design for Micro & Nano Manufacture — The "PATENT-DfMM Network of Excellence: Modelling & Simulation Cluster

Adhesion of Arbitrary-Shaped Thin-Film Microstructures

Numerical Identification of Geometric Parameters from Dynamic Measurement of Grinded Membranes on Wafer Level

Truly Nonlinear Model-Order Reduction Techniques

Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations

Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications

Multi-Physics Modeling and Finite Element Approximation of Charge Flow in Ionic Channels

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
Latest Publications