2019 IEEE Hot Chips 31 Symposium (HCS)
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9781728120898
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

AMD “ZEN 2”

2019 ◽  
Author(s):  
David Suggs ◽  
Dan Bouvier ◽  
Michael Clark ◽  
Kevin Lepak ◽  
Mahesh Subramony

IBM’s Next Generation POWER Processor

2019 ◽  
Author(s):  
Jeff Stuecheli ◽  
Scott Willenborg ◽  
William Starke
Keyword(s):  
Next Generation ◽  
Generation Power

Lakefield: Hybrid cores in 3D Package

2019 ◽  
Author(s):  
Sanjeev Khushu ◽  
Wilfred Gomes
Keyword(s):  
3D Package

A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing

2019 ◽  
Author(s):  
Hongyang Jia ◽  
H. Valavi ◽  
Y. Tang ◽  
J. Zhang ◽  
N. Verma
Keyword(s):  
Embedded Microprocessor

Xilinx First 7nm Device: Versal AI Core (VC1902)

2019 ◽  
Author(s):  
Sagheer Ahmad ◽  
Sridhar Subramanian ◽  
Vamsi Boppana ◽  
Shankar Lakka ◽  
Fu-Hing Ho ◽  
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