2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Latest Publications

TOTAL DOCUMENTS

135

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781509061853

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Novel time domain integral equation method hybridized with the macromodels of circuits

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874426 ◽

2016 ◽

Author(s):

Huan Huan Zhang ◽

He Ming Yao ◽

Li Jun Jiang

Keyword(s):

Integral Equation ◽

Time Domain ◽

Integral Equation Method ◽

Equation Method ◽

Domain Integral ◽

Time Domain Integral Equation

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Title page

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874392 ◽

2016 ◽

Keyword(s):

Title Page

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Process robustness and reproducibility of sub-mm wave flip-chip interconnect assembly

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874427 ◽

2016 ◽

Author(s):

S. Monayakul ◽

S. Sinha ◽

F. J. Schmuckle ◽

M. Hrobak ◽

D. Stoppel ◽

...

Keyword(s):

Flip Chip ◽

Process Robustness

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Hierarchical modeling and scalable algorithms for in-situ analysis of integrated circuit packages

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874404 ◽

2016 ◽

Author(s):

Zhen Peng ◽

Yang Shao ◽

Shu Wang

Keyword(s):

Integrated Circuit ◽

Hierarchical Modeling ◽

In Situ Analysis ◽

Scalable Algorithms

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A prediction method of heat generation in the silicon substrate for 3-D ICs

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874415 ◽

2016 ◽

Author(s):

Yi-An Hsu ◽

Chi-Hsuan Cheng ◽

Tzong-Lin Wu ◽

Yi-Chang Lu

Keyword(s):

Heat Generation ◽

Silicon Substrate ◽

Prediction Method

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Evaluation of near-singular integrals for quadrilateral basis in integral equation solver

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874405 ◽

2016 ◽

Author(s):

Chong Luo ◽

Giacomo Bianconi ◽

Swagato Chakraborty

Keyword(s):

Integral Equation ◽

Singular Integrals

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A stabilized leapfrog scheme for circuit-based analysis of power delivery network

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874400 ◽

2016 ◽

Author(s):

Tadatoshi Sekine ◽

Hideki Asai

Keyword(s):

Power Delivery ◽

Power Delivery Network ◽

Leapfrog Scheme ◽

Delivery Network

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Impact of fiber weaves on 56 Gbps SerDes interface in glass epoxy packages

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874431 ◽

2016 ◽

Author(s):

Ahmet C. Durgun ◽

Kemal Aygun

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Reduction of PDN induced coupling into signal lines using PTL power distribution

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874422 ◽

2016 ◽

Author(s):

David C. Zhang ◽

Madhavan Swaminathan ◽

David Keezer

Keyword(s):

Power Distribution

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Performace modeling and optimization for on-chip interconnects in memory arrays

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps.2016.7874429 ◽

2016 ◽

Author(s):

Javaneh Mohseni ◽

Chenyun Pan ◽

Azad Naeemi

Keyword(s):

Modeling And Optimization ◽

Memory Arrays ◽

On Chip

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2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Novel time domain integral equation method hybridized with the macromodels of circuits

Title page

Process robustness and reproducibility of sub-mm wave flip-chip interconnect assembly

Hierarchical modeling and scalable algorithms for in-situ analysis of integrated circuit packages

A prediction method of heat generation in the silicon substrate for 3-D ICs

Evaluation of near-singular integrals for quadrilateral basis in integral equation solver

A stabilized leapfrog scheme for circuit-based analysis of power delivery network

Impact of fiber weaves on 56 Gbps SerDes interface in glass epoxy packages

Reduction of PDN induced coupling into signal lines using PTL power distribution

Performace modeling and optimization for on-chip interconnects in memory arrays

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Latest Publications