2018 China Semiconductor Technology International Conference (CSTIC)
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177
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3
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Published By IEEE

9781538653081
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

PVD systems for advanced packaging applications

2018 ◽  
Author(s):  
Jinguo Zhen ◽  
Kuanmao Wang ◽  
Wei Xia ◽  
Hougong Wang ◽  
Peijun Ding
Keyword(s):  
Advanced Packaging

STI scratch defects reduction by using solid pad in 1X technology node

2018 ◽  
Author(s):  
Kuang-Wei Chen ◽  
Yen-Ting Chen ◽  
Chun-Fu Chen ◽  
Tuung Luoh ◽  
Lin-Wuu Yang ◽  
...  
Keyword(s):  
Technology Node

Impact of TID radiation on hot-carrier effects in 65NM bulk Si NMOSFETs

2018 ◽  
Author(s):  
Zhexuan Ren ◽  
Xia An ◽  
Jianing Wang ◽  
Xing Zhang ◽  
Ru Huang
Keyword(s):  
Hot Carrier ◽  
Hot Carrier Effects

Achieving mastery in chip manufacturing

2018 ◽  
Author(s):  
Cyril-Patrick Fernandez ◽  
Jim Jensen

Study of unique pseudo buried layer in 0.18um SiGe BiCMOS process

2018 ◽  
Author(s):  
Donghua Liu ◽  
Xi Chen ◽  
David Wei Zhang
Keyword(s):  
Sige Bicmos ◽  
Bicmos Process ◽  
Buried Layer

The development of novel STI spacer in an EPI free SiGe BiCMOS Process

2018 ◽  
Author(s):  
Donghua Liu ◽  
Ziquan Fang ◽  
Wensheng Qian
Keyword(s):  
Sige Bicmos ◽  
Bicmos Process
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