ScienceGate
Advanced Search
Author Search
Journal Finder
Blog
Sign in / Sign up
ScienceGate
Search
Author Search
Journal Finder
Blog
Sign in / Sign up
wafer level packaging
Recently Published Documents
TOTAL DOCUMENTS
746
(FIVE YEARS 144)
H-INDEX
27
(FIVE YEARS 3)
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging
The International Journal of Advanced Manufacturing Technology
◽
10.1007/s00170-021-08622-x
◽
2022
◽
Author(s):
Fumihiro Inoue
◽
Alain Phommahaxay
◽
Yohei Gokita
◽
Berthold Möller
◽
Eric Beyne
Keyword(s):
Wafer Level
◽
Wafer Level Packaging
Download Full-text
Development of 3D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology
IEEE Transactions on Components Packaging and Manufacturing Technology
◽
10.1109/tcpmt.2022.3140863
◽
2022
◽
pp. 1-1
Author(s):
Zuohuan Chen
◽
Daquan Yu
Keyword(s):
Wafer Level
◽
Thin Glass
◽
Wafer Level Packaging
Download Full-text
Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform
10.1109/eptc53413.2021.9663922
◽
2021
◽
Author(s):
Tc Chai
◽
David Ho
◽
Sc Chong
◽
Ps Sharon Lim
◽
Hy Hsiao
◽
...
Keyword(s):
Heterogeneous Integration
◽
Wafer Level
◽
Wafer Level Packaging
Download Full-text
SAW Cavity Sealing using Dielectric film in Wafer-level packaging
10.1109/eptc53413.2021.9663985
◽
2021
◽
Author(s):
Chockanathan Vinoth Kanna
◽
Soon Wee Ho
Keyword(s):
Dielectric Film
◽
Wafer Level
◽
Wafer Level Packaging
Download Full-text
Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging
10.1109/eptc53413.2021.9663975
◽
2021
◽
Author(s):
Lau Boon Long
◽
David Ho
◽
Lim Teck Guan
◽
Hsiao Hsiang Yao
◽
Lim Pei Siang
◽
...
Keyword(s):
Fabrication Process
◽
Wafer Level
◽
Process Flow
◽
Wafer Level Packaging
Download Full-text
Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging
10.1002/9781119793908.ch10
◽
2021
◽
pp. 233-260
Author(s):
Subramanian S. Iyer
◽
Arsalan Alam
Keyword(s):
Wafer Level
◽
Wafer Level Packaging
Download Full-text
Advanced Embedded Trace Substrate – A Flexible Alternative to Fan‐Out Wafer Level Packaging
10.1002/9781119793908.ch9
◽
2021
◽
pp. 217-231
Author(s):
Shih Ping Hsu
◽
Byron Hsu
◽
Adan Chou
Keyword(s):
Wafer Level
◽
Wafer Level Packaging
Download Full-text
High Gain and Low Profile Magnetic Current Array Antenna on Fan-out Wafer Level Packaging
10.1109/imws-amp53428.2021.9643933
◽
2021
◽
Author(s):
Wen Wu
◽
Zhihao Chen
Keyword(s):
High Gain
◽
Array Antenna
◽
Wafer Level
◽
Magnetic Current
◽
Wafer Level Packaging
◽
Low Profile
Download Full-text
Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing
10.1007/978-3-030-79749-2_7
◽
2021
◽
pp. 187-215
Author(s):
Jikai Xu
◽
Zhihao Ren
◽
Bowei Dong
◽
Chenxi Wang
◽
Yanhong Tian
◽
...
Keyword(s):
Wafer Bonding
◽
Wafer Level
◽
Wafer Level Packaging
◽
Bonding Technology
Download Full-text
Multi-port Metasurface Antenna on Fan-out Wafer Level Packaging
10.1109/csrswtc52801.2021.9631668
◽
2021
◽
Author(s):
Lin Zhong
◽
Zihao Chen
Keyword(s):
Wafer Level
◽
Wafer Level Packaging
Download Full-text
Load More ...
Sign in / Sign up
Close
Export Citation Format
Close
Share Document
Close