wafer level packaging
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Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform

2021 ◽  
Author(s):  
Tc Chai ◽  
David Ho ◽  
Sc Chong ◽  
Ps Sharon Lim ◽  
Hy Hsiao ◽  
...  
Keyword(s):  
Heterogeneous Integration ◽  
Wafer Level ◽  
Wafer Level Packaging

SAW Cavity Sealing using Dielectric film in Wafer-level packaging

2021 ◽  
Author(s):  
Chockanathan Vinoth Kanna ◽  
Soon Wee Ho
Keyword(s):  
Dielectric Film ◽  
Wafer Level ◽  
Wafer Level Packaging

Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging

2021 ◽  
Author(s):  
Lau Boon Long ◽  
David Ho ◽  
Lim Teck Guan ◽  
Hsiao Hsiang Yao ◽  
Lim Pei Siang ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Wafer Level ◽  
Process Flow ◽  
Wafer Level Packaging

Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging

2021 ◽  
pp. 233-260
Author(s):  
Subramanian S. Iyer ◽  
Arsalan Alam
Keyword(s):  
Wafer Level ◽  
Wafer Level Packaging

Advanced Embedded Trace Substrate – A Flexible Alternative to Fan‐Out Wafer Level Packaging

2021 ◽  
pp. 217-231
Author(s):  
Shih Ping Hsu ◽  
Byron Hsu ◽  
Adan Chou
Keyword(s):  
Wafer Level ◽  
Wafer Level Packaging

Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing

2021 ◽  
pp. 187-215
Author(s):  
Jikai Xu ◽  
Zhihao Ren ◽  
Bowei Dong ◽  
Chenxi Wang ◽  
Yanhong Tian ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Bonding Technology
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