2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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9781728160702
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LTD PKG. (Liquid Thermal Dissipation Package) Technology

2019 ◽  
Author(s):  
Yu Lung Huang ◽  
C. Key Chung ◽  
C.F. Lin ◽  
Bruce Xu ◽  
Yunn Shiuan Liao
Keyword(s):  
Thermal Dissipation

6-DoF Force/Torque Sensor

2019 ◽  
Author(s):  
Chih-Che Lin ◽  
Chung-Yuan Su ◽  
Shih-Ting Lin ◽  
Chih-Yuan Chen ◽  
Chien-Nan Yeh ◽  
...  
Keyword(s):  
Torque Sensor

Study on the Assembly Technology of Die-First/Face-Down Type FO-PLP

2019 ◽  
Author(s):  
Masaaki Takekoshi ◽  
Kenji Shimada ◽  
Naoya Suzuki ◽  
Toshihisa Nonaka
Keyword(s):  
Assembly Technology

Study of Improvement and Verification for Fan Wall of Network Rack Server using Six Sigma

2019 ◽  
Author(s):  
Kuo-Chi Chang ◽  
Kai-Chun Chu ◽  
Tsou-Li Chen ◽  
Yueh-Lung Ward Lee ◽  
Yuh-Chung Lin ◽  
...  
Keyword(s):  
Six Sigma

Study of the High-tech Process Mechanical Integrity and Electrical Safety

2019 ◽  
Author(s):  
Kuo-Chi Chang ◽  
Kai-Chun Chu ◽  
Tsou-Li Chen ◽  
Yueh-Lung Ward Lee ◽  
Yuh-Chung Lin ◽  
...  
Keyword(s):  
Electrical Safety ◽  
High Tech ◽  
Mechanical Integrity
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