IEEE Transactions on Components Packaging and Manufacturing Technology Part B
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Published By Institute Of Electrical And Electronics Engineers

1558-3686, 1070-9894
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Inside front cover

1998 ◽  
Vol 21 (4) ◽  
pp. c2-c2 ◽  
Author(s):  
E.S. Kolesar ◽  
R.R. Reston
Keyword(s):  
Front Cover

Polymeric conductive pastes as solder replacement for flip-chip attachment

1998 ◽  
Vol 21 (4) ◽  
pp. 382-393 ◽  
Author(s):  
Kaoru U. Maner ◽  
Simon S. Ang ◽  
Leonard W. Schaper ◽  
William D. Brown
Keyword(s):  
Flip Chip ◽  
Chip Attachment

Foreword: Microelectronics system integration

1998 ◽  
Vol 21 (4) ◽  
pp. 322-323
Author(s):  
Hamid Bolouri ◽  
Laurence E. Laforge
Keyword(s):  
System Integration

An 8-bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C airborne early warning aircraft radar

1998 ◽  
Vol 21 (4) ◽  
pp. 447-462 ◽  
Author(s):  
Rick L. Thompson ◽  
Michael J. Degerstrom ◽  
Wayne L. Walters ◽  
Mark E. Vickberg ◽  
Paul J. Riemer ◽  
...  
Keyword(s):  
Early Warning ◽  
Multichip Module ◽  
Digital Receiver

Solder-jetted eutectic PbSn bumps for flip-chip

1998 ◽  
Vol 21 (4) ◽  
pp. 371-381 ◽  
Author(s):  
Antal F. J. Baggerman ◽  
Daniel Schwarzbach
Keyword(s):  
Flip Chip

Editor's statement

1998 ◽  
Vol 21 (4) ◽  
pp. 479-479
Author(s):  
J. Peter Krusius

[Front cover]

1998 ◽  
Vol 21 (4) ◽  
pp. c1-c1
Author(s):  
H. Bolouri ◽  
L.E. Laforge
Keyword(s):  
Front Cover
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