IEEE Transactions on Electronics Packaging Manufacturing
Latest Publications

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749

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Published By Institute Of Electrical And Electronics Engineers

1558-0822, 1521-334x

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List of Reviewers

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2086176 ◽

2010 ◽

Vol 33 (4) ◽

pp. 243-243

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Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2078824 ◽

2010 ◽

Vol 33 (4) ◽

pp. 289-302 ◽

Cited By ~ 4

Author(s):

Pradeep Lall ◽

Prashant Gupta ◽

Manish Kulkarni ◽

James Hofmeister

Keyword(s):

Electronic Systems ◽

Time Frequency ◽

Shock Impact ◽

Impact Reliability

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Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2057512 ◽

2010 ◽

Vol 33 (4) ◽

pp. 275-283 ◽

Cited By ~ 106

Author(s):

Jinsoo Noh ◽

Dongsun Yeom ◽

Chaemin Lim ◽

Hwajin Cha ◽

Jukyung Han ◽

...

Keyword(s):

Roll To Roll

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Editorial - CPMT Society to Merge Transactions in 2011

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2087070 ◽

2010 ◽

Vol 33 (4) ◽

pp. 241-242

Author(s):

R. Wayne Johnson

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An Integrated Manufacturing System for the Design, Fabrication, and Measurement of Ultra-Precision Freeform Optics

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2052811 ◽

2010 ◽

Vol 33 (4) ◽

pp. 244-254 ◽

Cited By ~ 2

Author(s):

L. B. Kong ◽

C. F. Cheung ◽

W. B. Lee ◽

S. To

Keyword(s):

Manufacturing System ◽

Integrated Manufacturing ◽

Freeform Optics ◽

Ultra Precision

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Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2084092 ◽

2010 ◽

Vol 33 (4) ◽

pp. 303-311 ◽

Cited By ~ 9

Author(s):

R. A. Amy ◽

G. S. Aglietti ◽

G. Richardson

Keyword(s):

Experimental Approach ◽

Failure Criteria ◽

Printed Circuit ◽

Board Level

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IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2094011 ◽

2010 ◽

Vol 33 (4) ◽

pp. 324-324

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IEEE Components, Packaging, and Manufacturing Technology Society Information

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2093392 ◽

2010 ◽

Vol 33 (4) ◽

pp. C4-C4

Keyword(s):

Manufacturing Technology

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Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis–Taguchi Analysis

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2055873 ◽

2010 ◽

Vol 33 (4) ◽

pp. 265-274 ◽

Cited By ~ 18

Author(s):

Jay C. Y. Huang

Keyword(s):

Solder Paste ◽

Taguchi Analysis ◽

Surface Mount

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IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/tepm.2010.2094010 ◽

2010 ◽

Vol 33 (4) ◽

pp. 323-323

Download Full-text

IEEE Transactions on Electronics Packaging ManufacturingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Institute Of Electrical And Electronics Engineers

List of Reviewers

Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems

Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils

Editorial - CPMT Society to Merge Transactions in 2011

An Integrated Manufacturing System for the Design, Fabrication, and Measurement of Ultra-Precision Freeform Optics

Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

Leading the field since 1884 [advertisement]

IEEE Components, Packaging, and Manufacturing Technology Society Information

Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis–Taguchi Analysis

IEEE Foundation [advertisement]

IEEE Transactions on Electronics Packaging Manufacturing
Latest Publications