3D Microelectronic Packaging - Springer Series in Advanced Microelectronics
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15

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4

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Published By Springer International Publishing

9783319445847, 9783319445861

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Fundamentals of Heat Dissipation in 3D IC Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_10 ◽

2017 ◽

pp. 245-260 ◽

Author(s):

Satish G. Kandlikar ◽

Amlan Ganguly

Keyword(s):

Heat Dissipation ◽

3D Ic ◽

3D Ic Packaging ◽

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Interconnect Quality and Reliability of 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_14 ◽

2017 ◽

pp. 375-420 ◽

Author(s):

Yaodong Wang ◽

Yingxia Liu ◽

Menglu Li ◽

K. N. Tu ◽

Luhua Xu

Keyword(s):

3D Packaging ◽

Quality And Reliability

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Fundamentals of Solder Alloys in 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_8 ◽

2017 ◽

pp. 205-222 ◽

Author(s):

Kwang-Lung Lin

Keyword(s):

Solder Alloys ◽

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Die and Package Level Thermal and Thermal/Moisture Stresses in 3D Packaging: Modeling and Characterization

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_12 ◽

2017 ◽

pp. 293-332 ◽

Author(s):

Liangbiao Chen ◽

Tengfei Jiang ◽

Xuejun Fan

Keyword(s):

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Fault Isolation and Failure Analysis of 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_15 ◽

2017 ◽

pp. 421-459

Author(s):

Yan Li ◽

Deepak Goyal

Keyword(s):

Failure Analysis ◽

Fault Isolation ◽

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Materials and Processing of TSV

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_3 ◽

2017 ◽

pp. 47-69 ◽

Author(s):

Praveen Kumar ◽

Indranath Dutta ◽

Zhiheng Huang ◽

Paul Conway

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Fundamentals and Failures in Die Preparation for 3D Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_5 ◽

2017 ◽

pp. 101-128 ◽

Author(s):

Hualiang Shi ◽

Erasenthiran Poonjolai

Keyword(s):

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3D Packaging Architectures and Assembly Process Design

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_2 ◽

2017 ◽

pp. 17-46 ◽

Author(s):

Ravi Mahajan ◽

Bob Sankman

Keyword(s):

Process Design ◽

Assembly Process ◽

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Processing and Reliability of Solder Interconnections in Stacked Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_13 ◽

2017 ◽

pp. 333-373

Author(s):

Paul Vianco

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Microstructural and Reliability Issues of TSV

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_4 ◽

2017 ◽

pp. 71-99 ◽

Author(s):

Praveen Kumar ◽

Indranath Dutta ◽

Zhiheng Huang ◽

Paul Conway

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