3D Microelectronic Packaging - Springer Series in Advanced Microelectronics
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Published By Springer International Publishing

9783319445847, 9783319445861
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Fundamentals of Heat Dissipation in 3D IC Packaging

2017 ◽  
pp. 245-260 ◽  
Author(s):  
Satish G. Kandlikar ◽  
Amlan Ganguly
Keyword(s):  
Heat Dissipation ◽  
3D Ic ◽  
3D Ic Packaging ◽  
Ic Packaging

Interconnect Quality and Reliability of 3D Packaging

2017 ◽  
pp. 375-420 ◽  
Author(s):  
Yaodong Wang ◽  
Yingxia Liu ◽  
Menglu Li ◽  
K. N. Tu ◽  
Luhua Xu
Keyword(s):  
3D Packaging ◽  
Quality And Reliability

Materials and Processing of TSV

2017 ◽  
pp. 47-69 ◽  
Author(s):  
Praveen Kumar ◽  
Indranath Dutta ◽  
Zhiheng Huang ◽  
Paul Conway

Fundamentals and Failures in Die Preparation for 3D Packaging

2017 ◽  
pp. 101-128 ◽  
Author(s):  
Hualiang Shi ◽  
Erasenthiran Poonjolai
Keyword(s):  
3D Packaging

Microstructural and Reliability Issues of TSV

2017 ◽  
pp. 71-99 ◽  
Author(s):  
Praveen Kumar ◽  
Indranath Dutta ◽  
Zhiheng Huang ◽  
Paul Conway
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