Die and Package Level Thermal and Thermal/Moisture Stresses in 3D Packaging: Modeling and Characterization

2017 ◽  
pp. 293-332 ◽  
Author(s):  
Liangbiao Chen ◽  
Tengfei Jiang ◽  
Xuejun Fan
Keyword(s):  
3D Packaging

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

2017 ◽  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Two Dimensions ◽  
Analysis Tool ◽  
Active Device ◽  
Current Path ◽  
3D Packaging ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

Microstructural Considerations on the Reliability of 3D Packaging

2012 ◽  
Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma
Keyword(s):  
Mechanical Behavior ◽  
Grain Growth ◽  
Spinodal Decomposition ◽  
Elastic Energy ◽  
Modeling Approach ◽  
3D Packaging ◽  
Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

Multipurpose quick 3D packaging process

2011 ◽  
Author(s):  
Zhao Yongrui ◽  
Ma Hongbo ◽  
Bi Minglu ◽  
Huang Zhanwu ◽  
Jia Jun ◽  
...  
Keyword(s):  
Packaging Process ◽  
3D Packaging

scholarly journals 3D packaging architecture using paper as a dielectric medium

2008 ◽  
Author(s):  
Amin Rida ◽  
Li Yang ◽  
Napol Chaisilwattana ◽  
Scott Travis ◽  
Swapan Bhattacharya ◽  
...  
Keyword(s):  
Dielectric Medium ◽  
3D Packaging

Investigation of Heat Transfer in 3D Packaging for Practical-Scale Quantum Annealing Machines

2021 ◽  
Author(s):  
Wei Feng ◽  
Katsuya Kikuchi ◽  
Mutsuo Hidaka ◽  
Hirotake Yamamori ◽  
Yuuki Araga ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Quantum Annealing ◽  
3D Packaging
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