Failure Avoidance in Configurable Systems through Feature Locality

2013 ◽  
pp. 266-296 ◽  
Author(s):  
Brady J. Garvin ◽  
Myra B. Cohen ◽  
Matthew B. Dwyer
Keyword(s):  
Failure Avoidance ◽  
Configurable Systems

scholarly journals Foreword to the Special Issue on Configurable Systems

2021 ◽  
Vol 26 (4) ◽  
Author(s):  
Laurence Duchien ◽  
Paul Grünbacher ◽  
Thomas Thüm
Keyword(s):  
Special Issue ◽  
Configurable Systems

scholarly journals Machine learning and configurable systems

2020 ◽  
Author(s):  
Juliana Alves Pereira ◽  
Hugo Martin ◽  
Paul Temple ◽  
Mathieu Acher
Keyword(s):  
Machine Learning ◽  
Configurable Systems

Fault Tolerance Model for Efficient Actor Recovery Paradigm in WSAN

2021 ◽  
pp. 486-503
Author(s):  
Reem Khalid Mahjoub ◽  
Khaled Elleithy
Keyword(s):  
Fault Tolerance ◽  
Network Performance ◽  
Wireless Sensor ◽  
Network Integration ◽  
Node Failure ◽  
Failure Avoidance ◽  
Tolerance Model ◽  
Actor Networks ◽  
Selection Algorithms ◽  
Critical Node Detection

Wireless sensor and actor networks (WSAN) is an area where sensors and actors collaborate to sense, handle and perform tasks in real-time. Thus, reliability is an important factor. Due to the natural of WSAN, actor nodes are open to failure. Failure of actor nodes degrades the network performance and may lead to network disjoint. Thus, fault tolerance techniques should be applied to insure the efficiency of the network. In an earlier work, the authors proposed an efficient actor recovery paradigm (EAR) for WSAN which handles the critical actor node failure and recovery while maintaining QoS. EAR is supported with node monitoring and critical node detection (NMCND), network integration and message forwarding (NIMF), priority-based routing for node failure avoidance (PRNFA) and backup selection algorithms. In this article, the authors extend the work by adding a fault tolerance mathematical model. By evaluating the model, EAR shows to manage fault tolerance in deferent levels. To evaluate the effectiveness, the EAR fault tolerance is evaluated by simulation using OMNET++ Simulation. In addition, EAR reliability is measured and compared with RNF, DPCRA, ACR, and ACRA.

Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits

1991 ◽  
Vol 113 (1) ◽  
pp. 1-7 ◽  
Author(s):  
C. T. Leonard
Keyword(s):  
Electronic Equipment ◽  
Major Influence ◽  
Reliability Models ◽  
Temperature Reduction ◽  
Equipment Reliability ◽  
Electronics Reliability ◽  
Significant Temperature ◽  
Failure Avoidance ◽  
Electronic Parts ◽  
The Cost

Temperature is widely viewed as a major influence on failures of electronic equipment. Failure Prediction Methodology (FPM), such as MIL-HDBK-217 is an often quoted reference describing the temperature influence, often depicted as being exponential in effect, affecting wide classes of electronic component parts. The FPM concept of a constant failure rate that is accelerated by various environmental influences is widely applied beyond its validity. Misapplications of the reliability models in current use may cause failure avoidance efforts such as temperature reduction and parts quality selections not to yield anticipated overall results. The cost and complexity effects can be significant: temperature reduction, for example, can result in expensive system implementations in some cases whose costs and complexities may exceed the anticipated benefits in reliability. Due to industry wide continuing improvements in component quality over the years, the continuing quest for electronics reliability should change emphasis from attention to electronic parts to activities that address assembly and processes. This paper discusses the ways the temperature ingredient of reliability and similar concepts may be currently applied, with examples to illustrate disparities between anticipations and realizations. Alternate approaches are offered and their possible implementations are discussed.

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