General regulations for safe handling of manufactured nanomaterials

2022 ◽  
pp. 61-82
Author(s):  
Maria Batool ◽  
Muhammad Nadeem Zafar ◽  
Muhammad Faizan Nazar
Author(s):  
Dat Nguyen ◽  
Cuong Phan ◽  
Jeff Conner ◽  
Martin Smith ◽  
John Drummond

Abstract This paper describes a novel approach for safe handling of the thinned die from the front; a technique that can also be successfully applied to preserve cracked die. The discussion provides details on the characteristics and processes involved in backside reconstruction, thinned die reconstruction, and front-side deprocessing of thinned die. The finished backside reconstruction sample was cross-sectioned for examination using a diamond saw. After 6 hours of bake, no cracking of the thinned die was observed. Front-side deprocessing was then applied to the backside reconstructed sample. The sample remains intact. The technique has proven to be easily applied and highly reliable, and provides a solution for front-side deprocessing for both high pin count ball grid arrays and flip chips.


2013 ◽  
Vol 20 (4) ◽  
pp. 902-909
Author(s):  
Lin YANG ◽  
Hengyi XU ◽  
Meng YANG ◽  
Yonghua XIONG ◽  
Xiaolin HUANG

Author(s):  
João P. Vareda ◽  
Carlos A. García-González ◽  
Artur J. M. Valente ◽  
Rosana Simón-Vázquez ◽  
Marina Stipetic ◽  
...  

The toxicity and ecotoxicity effects, handling and disposal of synthetic amorphous silica nanoparticles and aerogels are reviewed and discussed.


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