Grain boundary heredity from Cu/Al solid-liquid interface via diffusion during the solidification processes
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2006 ◽
Vol 2006.19
(0)
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pp. 363-364
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2016 ◽
Vol 16
(5)
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pp. 2765-2770
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1973 ◽
Vol 19
(2)
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pp. 90-104
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Keyword(s):
1979 ◽
pp. 232-253
Keyword(s):
1973 ◽
Vol 19
(4)
◽
pp. 285-293
◽
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Keyword(s):
1979 ◽
pp. 254-266
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