The transition between small and long fatigue crack behavior and its relation to microstructure

2008 ◽  
Vol 30 (8) ◽  
pp. 1473-1478 ◽  
Author(s):  
M CAPPELLI ◽  
R CARLSON ◽  
G KARDOMATEAS
2014 ◽  
Vol 8 (30) ◽  
pp. 454-461 ◽  
Author(s):  
V. Di Cocco ◽  
F. Iacoviello ◽  
S. Natali ◽  
V. Volpe
Keyword(s):  

2009 ◽  
pp. 255-256
Author(s):  
Wen Zhong ◽  
Wenjian Wang ◽  
Qiyue Liu

2002 ◽  
Vol 124 (4) ◽  
pp. 385-390
Author(s):  
Ki-Ju Kang ◽  
Seon-Ho Choi ◽  
Tae-Sung Bae

Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with ΔJ and the procedure of fatigue crack propagation from the pre-crack tip were discussed.


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