Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
Keyword(s):
Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with ΔJ and the procedure of fatigue crack propagation from the pre-crack tip were discussed.
2003 ◽
Vol 220
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pp. 285-292
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2007 ◽
Vol 567-568
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pp. 409-412
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2008 ◽
pp. 227-227-25
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1989 ◽
Vol 11
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pp. 366-366
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Vol 11
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pp. 343-349
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1999 ◽
Vol 65
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pp. 1539-1545
2015 ◽
Vol 77
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pp. 64-77
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2019 ◽
Vol 120
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pp. 1-11
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