Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

2014 ◽  
Vol 148 (1-2) ◽  
pp. 125-133 ◽  
Author(s):  
N. Alayli ◽  
F. Schoenstein ◽  
A. Girard ◽  
K.L. Tan ◽  
P.R. Dahoo
Keyword(s):  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Process Parameters ◽  
Mechanical And Thermal Properties ◽  
Power Electronic ◽  
Silver Paste ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Sintered Silver

Effect of B doping on electrical and thermal properties of SiC bodies fabricated by spark plasma sintering

2019 ◽  
Vol 16 ◽  
pp. 211-215 ◽  
Author(s):  
Yukina Taki ◽  
Mettaya Kitiwan ◽  
Hirokazu Katsui ◽  
Takashi Goto
Keyword(s):  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
B Doping

Electric and thermal properties of wood charcoal made by spark plasma sintering

Carbon ◽  
1998 ◽  
Vol 36 (12) ◽  
pp. 1873-1874
Author(s):  
Takeshi Yamane ◽  
Shigehisa Ishihara ◽  
Hironori Okuda
Keyword(s):  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Wood Charcoal ◽  
Plasma Sintering ◽  
Spark Plasma

scholarly journals Optimization of process parameters for spark plasma sintering of nano structured SAF 2205 composite

2018 ◽  
Vol 7 (2) ◽  
pp. 126-134 ◽  
Author(s):  
Samuel Ranti Oke ◽  
Oladeji Oluremi Ige ◽  
Oluwasegun Eso Falodun ◽  
Babatunde Abiodun Obadele ◽  
Mxolisi Brendon Shongwe ◽  
...  
Keyword(s):  
Spark Plasma Sintering ◽  
Process Parameters ◽  
Optimization Of Process Parameters ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Saf 2205

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

2010 ◽  
Vol 638-642 ◽  
pp. 2115-2120 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Motohiro Tanaka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Packing Density ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Particle ◽  
Holding Time ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

scholarly journals Fabrication and Thermal Properties of Carbon Nanotube/Nickel Composite by Spark Plasma Sintering Method

2007 ◽  
Vol 48 (9) ◽  
pp. 2506-2512 ◽  
Author(s):  
Shunsuke Yamanaka ◽  
Ryohei Gonda ◽  
Akira Kawasaki ◽  
Hiroki Sakamoto ◽  
Yutaka Mekuchi ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Carbon Nanotube ◽  
Spark Plasma Sintering ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Sintering Method
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