Singular perturbation of an elastic energy with a singular weight

SINGULAR PERTURBATION OF BOUNDARY VALUE PROBLEM FOR QUASILINEAR HIGHER ORDINARY DIFFERENTIAL EQUATION

Acta Mathematica Scientia ◽

10.1016/s0252-9602(18)30277-7 ◽

1992 ◽

Vol 12 (1) ◽

pp. 98-112

Author(s):

Zongchi Lin ◽

Surong Lin

Keyword(s):

Differential Equation ◽

Ordinary Differential Equation ◽

Singular Perturbation ◽

Boundary Value Problem ◽

Boundary Value

Determination of stored elastic energy in plastically deformed copper

Zeitschrift für Kristallographie Supplements ◽

10.1524/zksu.2008.0009 ◽

2008 ◽

Vol 2008 (27) ◽

pp. 65-72

Author(s):

A. Baczmanski ◽

N. Hfaiedh ◽

M. Francois ◽

K. Saanouni ◽

K. Wierzbanowski

Keyword(s):

Elastic Energy ◽

Stored Elastic Energy

INTERMODE SCATTERING AS A SOURCE OF QUANTUM CHAOS IN A MICROWAVE RESONATOR SUBJECTED TO SINGULAR PERTURBATION

Telecommunications and Radio Engineering ◽

10.1615/telecomradeng.v73.i8.10 ◽

2014 ◽

Vol 73 (8) ◽

pp. 657-667

Author(s):

Ye. M. Ganapolsky ◽

Yu. V. Tarasov

Keyword(s):

Singular Perturbation ◽

Quantum Chaos ◽

Microwave Resonator

A Singular Perturbation Approach to Pitch-Loop Design

10.23919/acc.1990.4791044 ◽

1990 ◽

Cited By ~ 1

Author(s):

Eugene M. Cliff

Keyword(s):

Singular Perturbation ◽

Perturbation Approach ◽

Loop Design

Limited rate control with a singular perturbation approach

1997 European Control Conference (ECC) ◽

10.23919/ecc.1997.7082121 ◽

1997 ◽

Author(s):

A. Cavallo ◽

G. De Maria

Keyword(s):

Singular Perturbation ◽

Rate Control ◽

Perturbation Approach

Robust regulation of a class of nonlinear systems using singular perturbation approach

2003 European Control Conference (ECC) ◽

10.23919/ecc.2003.7085061 ◽

2003 ◽

Cited By ~ 2

Author(s):

R. Amjadifard ◽

M. J. Yazdanpanah ◽

M. T. H. Beheshti

Keyword(s):

Nonlinear Systems ◽

Singular Perturbation ◽

Perturbation Approach ◽

Robust Regulation

Singular perturbation stability conditions for adaptive control of a solar furnace with actuator dynamics

2009 European Control Conference (ECC) ◽

10.23919/ecc.2009.7074640 ◽

2009 ◽

Cited By ~ 5

Author(s):

B. Andrade Costa ◽

J.M. Lemos

Keyword(s):

Adaptive Control ◽

Singular Perturbation ◽

Solar Furnace ◽

Stability Conditions ◽

Actuator Dynamics

An Extension of Burzyński Hypothesis of Material Effort Accounting for the Third Invariant of Stress Tensor

Archives of Metallurgy and Materials ◽

10.2478/v10172-011-0054-4 ◽

2011 ◽

Vol 56 (2) ◽

pp. 503-508 ◽

Cited By ~ 11

Author(s):

R. Pęcherski ◽

P. Szeptyński ◽

M. Nowak

Keyword(s):

Stress Tensor ◽

Elastic Energy ◽

Yield Condition ◽

The Third ◽

Third Invariant ◽

Lode Angle

An Extension of Burzyński Hypothesis of Material Effort Accounting for the Third Invariant of Stress Tensor The aim of the paper is to propose an extension of the Burzyński hypothesis of material effort to account for the influence of the third invariant of stress tensor deviator. In the proposed formulation the contribution of the density of elastic energy of distortion in material effort is controlled by Lode angle. The resulted yield condition is analyzed and possible applications and comparison with the results known in the literature are discussed.

Problems in sonic boom theory studied as issues of singular perturbation

10.2514/6.1996-2165 ◽

1996 ◽

Author(s):

H. Cheng ◽

C. Lee

Keyword(s):

Singular Perturbation ◽

Sonic Boom

Microstructural Considerations on the Reliability of 3D Packaging

ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2012p0044 ◽

2012 ◽

Author(s):

Zhiheng Huang ◽

Zhiyong Wu ◽

Hua Xiong ◽

Yucheng Ma

Keyword(s):

Mechanical Behavior ◽

Grain Growth ◽

Spinodal Decomposition ◽

Elastic Energy ◽

Modeling Approach ◽

3D Packaging ◽

Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.