Low Temperature Fault Isolation Using Soft Defect Localization

Cold temperature failures are often difficult to resolve, especially those at extreme low levels (< -40°C). Momentary application of chill spray can confirm the failure mode, but is impractical during photoemission microscopy (PEM), laser scanning microscopy (LSM), and multiple point microprobing. This paper will examine relatively low-cost cold temperature systems that can hold samples at steady state extreme low temperatures and describe a case study where a cold temperature stage was combined with LSM soft defect localization (SDL) to rapidly identify the cause of a complex cold temperature failure mechanism.

Novel Failure Analysis Sample Preparation Techniques for PoP Packaging

Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package(PoP) with increasing demands is beneficial in cost and space saving. The main failure mechanisms associated with PoP technology, including open joints and warpage, have created a lot of challenges for Assembly and Failure Analysis (FA). This paper outlines the sample preparation process steps to overcome the challenges to enable successful failure analysis and optical probing.

An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism

Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing.

A Novel Integrated Reliability Test System for BEOL TDDB Study

In this paper, we propose a new methodology and test system to enable the early detection and precise localization of Time-Dependent-Dielectric-Breakdown (TDDB) occurrence in Back-End-of-Line (BEOL) interconnection. The methodology is implemented as a novel Integrated Reliability Test System (IRTS). In particular, through our methodology and test system, we can easily synchronize electrical measurements and emission microscopy images to gather more accurate information and thereby gain insight into the nature of the defects and their relationship to chip manufacturing steps and materials, so that we can ultimately better engineer these steps for higher reliable systems. The details of our IRTS will be presented along with a case study and preliminary analysis results.

Lock-in Thermography-Based Local Efficiency Analysis of Solar Cells

The electronic properties of solar cells, particularly multicrystalline silicon-based ones, are distributed spatially inhomogeneous, where regions of poor quality may degrade the performance of the whole cell. These inhomogeneities mostly affect the dark current-voltage (I-V) characteristic, which decisively affects the efficiency. Since the grid distributes the local voltage homogeneously across the cell and leads to lateral balancing currents, local light beam-induced current methods alone cannot be used to image local cell efficiency parameters. Lock-in thermography (LIT) is the method of choice for imaging inhomogeneities of the dark I-V characteristic. This contribution introduces a novel method for evaluating a number of LIT images taken at different applied biases. By pixel-wise fitting the data to a two diode model and taking into account local series resistance and short circuit current density data, realistically simulated images of the other cell efficiency parameters (open circuit voltage, fill factor, and efficiency) are obtained. Moreover, simulated local and global dark and illuminated I-V characteristics are obtained, also for various illumination intensities. These local efficiency data are expectation values, which would hold if a homogeneous solar cell had the properties of the selected region of the inhomogeneous cell. Alternatively, also local efficiency data holding for the cell working at its own maximum power point may be generated. The amount of degradation of different cell efficiency parameters in some local defect positions is an indication how dangerous these defects are for degrading this parameter of the whole cell. The method allows to virtually 'cut out' certain defects for checking their influence on the global characteristics. Thus, by applying this method, a detailed local efficiency analysis of locally inhomogeneous solar cells is possible. It can be reliably predicted how a cell would improve if certain defects could be avoided. This method is implemented in a software code, which is available.

Lithium-ion Battery Degradation Mechanisms and Failure Analysis Methodology

A review of the prevalent degradation mechanisms in Lithium ion batteries is presented. Degradation and eventual failure in lithium-ion batteries can occur for a variety of dfferent reasons. Degradation in storage occurs primarily due to the self-discharge mechanisms, and is accelerated during storage at elevated temperatures. The degradation and failure during use conditions is generally accelerated due to the transient power requirements, the high frequency of charge/discharge cycles and differences between the state-of-charge and the depth of discharge influence the degradation and failure process. A step-by-step methodology for conducting a failure analysis of Lithion batteries is presented. The failure analysis methodology is illustrated using a decision-tree approach, which enables the user to evaluate and select the most appropriate techniques based on the observed battery characteristics. The techniques start with non-destructive and non-intrusive steps and shift to those that are more destructive and analytical in nature as information about the battery state is gained through a set of measurements and experimental techniques.

Case Study: Combined Dynamic Laser Stimulation and Static Emission Microscopy Techniques Applied to Scan Test Failure on Mixed Mode Device

This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at the silicon bulk level.

VIS-NIR LED Illumination in Backside Circuit Edit and Optical Probing Applications

High resolution optical imaging is critical in assisting backside circuit edit (CE) and optical probing navigation. In this paper, we demonstrated improved optical image quality using VIS-NIR narrow band light emitting diode (LED) illumination in various FIB and optical probing platforms. The proof of concept was demonstrated with both common non-contact air gap lenses and solid immersion lenses (SIL).

Sample Preparation Challenges In WLCSP Epoxy Underfill Coating Removal

Most Wafer Level Chip Scale Package (WLCSP) units returned by customers for failure analysis are mounted on PCB modules with an epoxy underfill coating. The biggest challenge in failure analysis is the sample preparation to remove the WLCSP device from the PCB without inducing any mechanical defect. This includes the removal of the underfill material to enable further electrical verification and fault isolation analysis. This paper discusses the evaluations conducted in establishing the WLCSP demounting process and removal of the epoxy underfill coating. Combinations of different sample preparation techniques and physical failure analysis steps were evaluated. The established process enabled the electrical verification, fault isolation and further destructive analysis of WLCSP customer returns mounted on PCB and with an epoxy underfill coating material. This paper will also showcase some actual full failure analysis of WLCSP customer returns where the established process played a vital role in finding the failure mechanism.

Alternative Lapping Method to Reduce Edge Rounding Effect

Polishing is a simple and direct method to prepare samples for failure analysis and characterization. However, polishing commonly gives rise to the issue of rounding at the sample's corners and edges. This is believed to have arisen from the uneven distribution of polishing slurry between the edges and sample surface during polishing. Thus, we propose a new lapping method to reduce the rounding effect. From our experiments, negligible rounding effect was observed on a 9 mm by 7 mm die after a depth of ~ 2 μm of material was removed using our proposed alternative lapping method.