Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules

2013 ◽  
Vol 68 (8) ◽  
pp. 607-610 ◽  
Author(s):  
Yuming Zhang ◽  
Honglai Zhu ◽  
Masami Fujiwara ◽  
Jinquan Xu ◽  
Ming Dao
Keyword(s):  
Low Temperature ◽  
Electronic Packaging ◽  
Reliability Prediction ◽  
Solder Alloys ◽  
Snagcu Solder ◽  
Temperature Creep ◽  
Low Temperature Creep

Low-temperature creep in polycrystalline α-brass

1971 ◽  
Vol 5 (5) ◽  
pp. 411-416 ◽  
Author(s):  
Y.V.R.K. Prasad ◽  
T. Ramchandran
Keyword(s):  
Low Temperature ◽  
Temperature Creep ◽  
Low Temperature Creep

Low temperature creep of titanium

1971 ◽  
Vol 8 (3) ◽  
pp. 134-140 ◽  
Author(s):  
R. Zeyfang ◽  
R. Martin ◽  
H. Conrad
Keyword(s):  
Low Temperature ◽  
Temperature Creep ◽  
Low Temperature Creep

LOW TEMPERATURE CREEP OF ZINC SINGLE CRYSTALS

1954 ◽  
Author(s):  
CHOH HSIEN LI ◽  
JACK WASHBURN ◽  
EARL R. PARKER
Keyword(s):  
Low Temperature ◽  
Single Crystals ◽  
Temperature Creep ◽  
Low Temperature Creep

Low temperature creep of Ti-6 Al-4 V

1974 ◽  
Vol 5 (5) ◽  
pp. 1207-1213 ◽  
Author(s):  
Ben C. Odegard ◽  
Anthony W. Thompson
Keyword(s):  
Low Temperature ◽  
Temperature Creep ◽  
Low Temperature Creep

scholarly journals Grain Size Variation during Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper

2013 ◽  
Vol 54 (9) ◽  
pp. 1605-1611 ◽  
Author(s):  
Satoshi Okubo ◽  
Yoji Miyajima ◽  
Toshiyuki Fujii ◽  
Susumu Onaka ◽  
Masaharu Kato
Keyword(s):  
Grain Size ◽  
Low Temperature ◽  
Tensile Deformation ◽  
Size Variation ◽  
Temperature Creep ◽  
Ultrafine Grained ◽  
Low Temperature Creep

scholarly journals Low temperature creep plasticity

2014 ◽  
Vol 3 (3) ◽  
pp. 280-288 ◽  
Author(s):  
Michael E. Kassner ◽  
Kamia Smith
Keyword(s):  
Low Temperature ◽  
Temperature Creep ◽  
Low Temperature Creep
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