2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

366

(FIVE YEARS 366)

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0

(FIVE YEARS 0)

Published By IEEE

9781665440974

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00018 ◽

2021 ◽

Author(s):

C. Rudolph ◽

A. Hanisch ◽

M. Voigtlander ◽

P. Gansauer ◽

H. Wachsmuth ◽

...

Keyword(s):

Process Parameters ◽

Manufacturing Equipment ◽

Simulated Process

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Chip/Package Co-Design Analysis of Advanced D2D Interface Using a Statistical Link Simulator

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00291 ◽

2021 ◽

Author(s):

Sangwook Park ◽

Heewoo An ◽

Seonghwan Jeon ◽

Gyoungbum Kim ◽

Dan Kyung Suk Oh

Keyword(s):

Design Analysis

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Metal Thermal Interface Material for the Next Generation FCBGA

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00109 ◽

2021 ◽

Author(s):

YunAh Kim ◽

JoHyun Bae ◽

HyunHye Jung ◽

MiKyoung Choi ◽

YoungDo Kweon ◽

...

Keyword(s):

Thermal Interface Material ◽

Next Generation ◽

Thermal Interface

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Study of the adhesion of a sintered Ag joint on a Cu substrate using laser shocks. Influence of aging

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00106 ◽

2021 ◽

Author(s):

Xavier Milhet ◽

Thibaut de Resseguier ◽

Loic Signor ◽

Etienne Barraud ◽

Kokouvi Happy N'Tsouaglo ◽

...

Keyword(s):

Cu Substrate ◽

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Selective Thinning Technology of Solder Resist for Ultra-Thin and High-Density IC Packaging

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00133 ◽

2021 ◽

Author(s):

Yuya Suzuki ◽

Yuji Toyoda

Keyword(s):

High Density ◽

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In-situ Determination of Specimen Temperature during Electromigration Testing of Solder Joint

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00279 ◽

2021 ◽

Author(s):

Mostafa AbdelAziz ◽

Michael Mayer

Keyword(s):

Solder Joint ◽

Specimen Temperature

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Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00263 ◽

2021 ◽

Author(s):

Ke Pan ◽

Jiefeng Xu ◽

Yangyang Lai ◽

Seungbae Park ◽

Chukwudi Okoro ◽

...

Keyword(s):

Thermal Cycling

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Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00224 ◽

2021 ◽

Author(s):

Yanfang Li ◽

Meng Li ◽

Fen Chen ◽

Guangyu Fan ◽

Ning-Cheng Lee

Keyword(s):

Thermal Conduction ◽

Graphite Sheets

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Fine Pitch Line/Space Lithography for Large Area Package with Multi-Field Stitching

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00321 ◽

2021 ◽

Author(s):

Soon Wee Ho ◽

Norman Yen ◽

Cliff McCold ◽

Robert Hsieh ◽

Ha-Ai Nguyen ◽

...

Keyword(s):

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Phase-field simulation of microstructure changes and crack propagation at Cu-Al wire bonding interface under high temperature circumstance

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00234 ◽

2021 ◽

Author(s):

Takuo Funaya ◽

Toshiyuki Koyama

Keyword(s):

High Temperature ◽

Crack Propagation ◽

Phase Field ◽

Wire Bonding ◽

Bonding Interface ◽

Phase Field Simulation ◽

Microstructure Changes ◽

Field Simulation

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