2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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9781665440974
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Multi-layered package substrate manufactured by reel-to-reel processes

2021 ◽  
Author(s):  
Jongwoo Park ◽  
Myungki Jung ◽  
Yongnam Kim ◽  
Soon-Chul Kwon ◽  
Sangmin Lee ◽  
...  

A TSV-Last Approach for 3D-IC Integration and Packaging using WNi Platable Barrier Layer

2021 ◽  
Author(s):  
Murugesan Mariappan ◽  
Kiyoharu Mori ◽  
Mitsumasa Koyanagi ◽  
Takafumi Fukushima
Keyword(s):  
Barrier Layer ◽  
3D Ic

Study of i-Line Photosensitive Materials with a Wide Depth of Focus for Fine Pitch Redistribution Layers

2021 ◽  
Author(s):  
Daiki Yukimori ◽  
Mei Kunito ◽  
Nobuhiro Ishikawa ◽  
Atsushi Sekiguchi ◽  
Toshiyuki Ogata
Keyword(s):  
Depth Of Focus ◽  
Fine Pitch

Reliability of Printed Microwave Electronics

2021 ◽  
Author(s):  
Simone Neermann ◽  
Joerg Franke ◽  
Mark Sippel ◽  
Konstantin Lomakin ◽  
Gerald Gold
Keyword(s):  
Microwave Electronics

Package Power Distribution Current Density in Applications with Large Transient Currents

2021 ◽  
Author(s):  
Matthew Doyle ◽  
Wiren D. Becker ◽  
Matteo Cocchini ◽  
Kyle Schoneck ◽  
Samuel Connor ◽  
...  
Keyword(s):  
Current Density ◽  
Power Distribution ◽  
Transient Currents

The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging

2021 ◽  
Author(s):  
Chien-Lung Liang ◽  
Min-Yan Tsai ◽  
Yung-Sheng Lin ◽  
I-Ting Lin ◽  
Sheng-Wen Yang ◽  
...  
Keyword(s):  
Dynamic Behavior
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