Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance

Carbon ◽  
2003 ◽  
Vol 41 (13) ◽  
pp. 2459-2469 ◽  
Author(s):  
Chia-Ken Leong ◽  
D.D.L. Chung
10.2514/3.870 ◽  
1997 ◽  
Vol 11 ◽  
pp. 129-140
Author(s):  
B. Merci ◽  
J. Steelant ◽  
J. Vierendeels ◽  
K. Riemslagh ◽  
E. Dick ◽  
...  

10.2514/3.871 ◽  
1997 ◽  
Vol 11 ◽  
pp. 141-145
Author(s):  
Andreas Haselbacher ◽  
Jiri Blazek ◽  
S. R. Mirmira ◽  
E. Marotta ◽  
L. S. Fletcher

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