Effect of loading and geometry on the subsonic/intersonic transition of a bimaterial interface crack

2003 ◽  
Vol 70 (2) ◽  
pp. 309-337 ◽  
Author(s):  
O Samudrala ◽  
A.J Rosakis
Keyword(s):  
Interface Crack ◽  
Bimaterial Interface ◽  
Bimaterial Interface Crack

Crack-Tip Field of a Supersonic Bimaterial Interface Crack

2002 ◽  
Vol 69 (5) ◽  
pp. 693-696 ◽  
Author(s):  
J. Wu
Keyword(s):  
Interface Crack ◽  
Crack Tip ◽  
Bimaterial Interface ◽  
Crack Tip Field ◽  
Asymptotic Field ◽  
Homogeneous Materials ◽  
Supersonic Regime ◽  
Bimaterial Interface Crack

The sextic approach was used to investigate the asymptotic field of a bimaterial interface crack in the entire supersonic regime and extended to include the combination of isotropic and homogeneous materials, where the sextic method had been considered difficult. Application to typical systems was demonstrated.

Computation of Thermal Stress Intensity Factors for Bimaterial Interface Cracks Using Domain Integral Method

2009 ◽  
Vol 76 (4) ◽  
Author(s):  
Ratnesh Khandelwal ◽  
J. M. Chandra Kishen
Keyword(s):  
Stress Intensity ◽  
Stress Intensity Factors ◽  
Thermal Loading ◽  
Thermal Stresses ◽  
Body Force ◽  
Bimaterial Interface ◽  
Intensity Factors ◽  
Linear Elastic ◽  
Domain Integral ◽  
Bimaterial Interface Crack

The concept of domain integral used extensively for J integral has been applied in this work for the formulation of J2 integral for linear elastic bimaterial body containing a crack at the interface and subjected to thermal loading. It is shown that, in the presence of thermal stresses, the Jk domain integral over a closed path, which does not enclose singularities, is a function of temperature and body force. A method is proposed to compute the stress intensity factors for bimaterial interface crack subjected to thermal loading by combining this domain integral with the Jk integral. The proposed method is validated by solving standard problems with known solutions.

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