Computation of Thermal Stress Intensity Factors for Bimaterial Interface Cracks Using Domain Integral Method

The concept of domain integral used extensively for J integral has been applied in this work for the formulation of J2 integral for linear elastic bimaterial body containing a crack at the interface and subjected to thermal loading. It is shown that, in the presence of thermal stresses, the Jk domain integral over a closed path, which does not enclose singularities, is a function of temperature and body force. A method is proposed to compute the stress intensity factors for bimaterial interface crack subjected to thermal loading by combining this domain integral with the Jk integral. The proposed method is validated by solving standard problems with known solutions.

Crack-Tip Field of a Supersonic Bimaterial Interface Crack

The sextic approach was used to investigate the asymptotic field of a bimaterial interface crack in the entire supersonic regime and extended to include the combination of isotropic and homogeneous materials, where the sextic method had been considered difficult. Application to typical systems was demonstrated.

A Note on Interface Cracks With and Without Friction in Contact Zone

A complete set of Comninou’s bimaterial interface crack-tip fields with and without friction in the contact zone (Comninou, 1977a,b) is given in terms of several arbitrary analytic functions. When the bimaterial becomes homogeneous, the complex function representation fully describes the crack-tip field for a cracked body under conditions of crack surface contact and slip, which can occur when the body is subjected to combined compression and shear loadings.