Tensile bond strengths of Comspan® to electrolytically etched metal with and without enamel bonding agent
2004 ◽
Vol 16
(4)
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pp. 249-249
1999 ◽
Vol 81
(5)
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pp. 510-514
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Keyword(s):
1988 ◽
Vol 94
(6)
◽
pp. 528
1987 ◽
Vol 92
(3)
◽
pp. 225-231
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Keyword(s):