03/02547 Heat transfer characteristics of an insulated regular cubic box by using a solid wedge thermal resistance model

2003 ◽  
Vol 44 (6) ◽  
pp. 408
2013 ◽  
Vol 663 ◽  
pp. 586-591 ◽  
Author(s):  
Li Ming Zhou ◽  
Lei Zhu ◽  
Jing Quan Zhao ◽  
Meng Zheng

Three-dimensional numerical simulation was implemented to analyze the heat transfer characteristics for jet impingement impact fin surface. 60 calculation cases were simulated to investigate the effects of different fin surfaces on heat transfer characteristics, and 12 jet array impingement cases were calculated for comparison. The results shown that the fin shape, the height and the fin arrangement were the critical factors to affect the jet impingement and the best combination were existed in a certain range. The thermal resistance of cylinder fin arranged in order was34.7 percent higher than that of cylinder fin arranged staggered. The thermal resistance of square fin arranged in order was38.9 percent higher than that of square fin arranged staggered .The heat transfer coefficients of impinging jet impact fin surface were better than that of jet array impingement. The fitting correlations on heat transfer of impinging jet impact fin surface were given.


2013 ◽  
Vol 448-453 ◽  
pp. 3291-3295
Author(s):  
Ge Ping Wu ◽  
Jun Wang ◽  
Ping Lu

Flow and heat transfer characteristics in the microchannel cooling passages with three different types of the MTPV systems are numerically investigated. Reynolds ranged from 100 to 1000 and hydraulic diameter from 0.4mm to 0.8mm. The steady, laminar flow and heat transfer equations are solved in a finite-volume method. The local heat transfer characteristics, thermal resistance, Nusselt numbers, friction factor and pressure losses of the different types are analyzed. A comparison of the heat transfer coefficient, pressure losses and friction factor of the different microchannels are also presented. The heat transfer performance of the rob bundles microchannel is found to be much better than others. However, the rectangular passage has the lowest thermal resistance than the other types of microchannels.


Author(s):  
Sathish Kumar D ◽  
Jayavel S

Abstract Miniaturization of electronic components requires compact and effective cooling techniques to dissipate large heat flux without significant increase in pumping power. Microchannel heat sink with liquid as working fluid is a suitable technique for the purpose. In the present study, heat transfer characteristics in presence of vertical bifurcation placed in the downstream of the microchannel passage is studied numerically. Six types of bifurcating plates are considered under two categories: (i) thick-plate and (ii) wavy thin-wall. Water is taken as the working fluid and the flow rate has been varied in the Reynolds number range, 100 = Re = 1000.The effect of bifurcations on pressure drop, heat transfer and the overall thermal resistance are analyzed and compared with those of plane microchannel without bifurcation. The numerical results show that the usage of bifurcation in the microchannel reduces the overall thermal resistance. Field synergy number, entropy generation number and hydro-thermal performance index are calculated to quantify the overall performance improvement in the microchannel with bifurcations. Constant wavy thin-wall bifurcation has been found to improve the overall performance of the microchannel. The detailed geometry of the bifurcation, the resulting convective heat transfer characteristics and percentage improvement in the performance are reported.


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