Recrystallization of a new layered silicate from Na-kanemite–tetramethylammonium hydroxide–water–1,4-dioxane mixture

2002 ◽  
Vol 12 (5) ◽  
pp. 1374-1380 ◽  
Author(s):  
Fathi Kooli
Keyword(s):  
Layered Silicate ◽  
Tetramethylammonium Hydroxide ◽  
Hydroxide Water ◽  
Dioxane Mixture

Effect of alkali cations on the conversion of H-magadiite in tetramethylammonium hydroxide–water–1,4-dioxane system

2003 ◽  
Vol 77 (1) ◽  
pp. 134-140 ◽  
Author(s):  
Fathi Kooli ◽  
Yoshimichi Kiyozumi ◽  
Fujio Mizukami
Keyword(s):  
Tetramethylammonium Hydroxide ◽  
Alkali Cations ◽  
Hydroxide Water

The Use of TMAH to Etch Silicon and Expose Metal Bridging Failures

2000 ◽  
Author(s):  
Mark Morris ◽  
James Mohr ◽  
Esteban Ortiz ◽  
Steven Englebretson
Keyword(s):  
Failure Mechanism ◽  
Schottky Diodes ◽  
Tetramethylammonium Hydroxide ◽  
Novel Approach ◽  
Failure Location ◽  
Metal Etching ◽  
Plastic Mold

Abstract Determination of metal bridging failures on plastic encapsulated devices is difficult due to the metal etching effects that occur while removing many of the plastic mold compounds. Typically, the acids used to remove the encapsulation are corrosive to the metals that are found within the device. Thus, decapsulation can result in removal of the failure mechanism. Mechanical techniques are often not successful due to damage that results in destruction of the die and failure mechanism. This paper discusses a novel approach to these types of failures using a silicon etch and a backside evaluation. The desirable characteristics of the technique would be to remove the silicon and leave typical device metals unaffected. It would also be preferable that the device passivation and oxides not be etched so that the failure location is not disturbed. The use of Tetramethylammonium Hydroxide (TMAH), was found to fit these prerequisites. The technique was tested on clip attached Schottky diodes that exhibited resistive shorting. The use of the TMAH technique was successful at exposing thin solder bridges that extruded over the edge of the die resulting in failure.

Measurement of V50 Behavior of a Nylon 6-Based Polymer-Layered Silicate Nanocomposite

2001 ◽  
Author(s):  
David Ostermayer ◽  
Frederick L. Beyer ◽  
Peter G. Dehmer ◽  
Melissa A. Klusewitz
Keyword(s):  
Layered Silicate ◽  
Nylon 6

Effect of Textured Surfactant Brushes on Polymer-Layered Silicate Nanocomposite Morphology

2004 ◽  
Author(s):  
Mary K. Kurian ◽  
Arnab Dasgupta ◽  
Mary E. Galvin ◽  
Frederick L. Beyer
Keyword(s):  
Layered Silicate

Prevention of hematite settling using synthetic layered silicate while drilling high-pressure wells

2020 ◽  
Vol 13 (12) ◽  
Author(s):  
Salem Basfar ◽  
Salaheldin Elkatatny
Keyword(s):  
High Pressure ◽  
Layered Silicate

Thermally-cured and e-beam-cured epoxy layered-Silicate nanocomposites

2003 ◽  
Vol 49 (6) ◽  
pp. 473-480 ◽  
Author(s):  
Chenggang Chen ◽  
David Curliss
Keyword(s):  
Layered Silicate ◽  
Silicate Nanocomposites

scholarly journals Properties and Structure of the Friction surface of PTFE / Layered Silicate Composites

2021 ◽  
Vol 1079 (4) ◽  
pp. 042033
Author(s):  
S A Sleptsova ◽  
S Laukkanen ◽  
P N Tarasova
Keyword(s):  
Friction Surface ◽  
Layered Silicate

scholarly journals Preparation and Insulation Properties of Epoxy-Layered Silicate Nanocomposite

2004 ◽  
Vol 124 (11) ◽  
pp. 1065-1072 ◽  
Author(s):  
Takahiro Imai ◽  
Fumio Sawa ◽  
Tamon Ozaki ◽  
Toshiyuki Nakano ◽  
Toshio Shimizu ◽  
...  
Keyword(s):  
Layered Silicate
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