Relationship between surface free energy and development process (swelling and dissolution kinetics) of poly(4-hydroxystyrene) film in water and 2.38 wt% tetramethylammonium hydroxide aqueous solution

With the sharpening of optical images, the capability of resist materials has become a serious concern in lithography. The dissolution of a resist polymer is key to the realization of ultrafine patterning. However, the details of the dissolution of resist polymers remain unclarified. In this study, the relationships of surface free energy with swelling and dissolution kinetics were investigated using poly(4-hydroxystyrene) (PHS) film with triphenylsulfonium-nonaflate (TPS-nf). Developers were water and 2.38 wt% tetramethylammonium hydroxide (TMAH) aqueous solution. PHS and TPS-nf are a typical backbone polymer (a dissolution agent) and a typical acid generator of chemically amplified resists, respectively. The water intake and dissolution of PHS film with TPS-nf became fast with increasing UV exposure dose. It was found that the increase in the polar components (particularly, the hydrogen bonding component) and the decrease in the dispersion component of surface free energy underlie the fast water intake and dissolution.