In recent years, heat dissipation in micro-electronic systems has become a significant design limitation for many component manufactures. As electronic devices become smaller, the amount of heat generation per unit area increases significantly. Current heat dissipation systems have implemented forced convection with both air and fluid media. However, nanofluids may present an advantageous and ideal cooling solution. In the present study, a model has been developed to estimate the enhancement of the heat transfer when nanoparticles are added to a base fluid, in a single microchannel. The model assumes a homogeneous nanofluid mixture, with thermo-physical properties based on previous experimental and simulation based data. The effect of nanofluid concentration on the dynamics of the bubble has been simulated. The results show the change in bubble contact angles due to deposition of the nanoparticles has more effect on the wall heat transfer compared to the effect of thermo-physical properties change by using nanofluid.
One-dimensional electronic systems: metal-chain complexes and organic conductors
