FINITE ELEMENT PROCEDURE FOR HEAT CONDUCTION PROBLEMS WITH INTERNAL HEATING

Being aimed to deformation problem of pre-stressed concrete thin-walled multi-room box girders exposed to co-action of fire and load, on the basis of enthalpy conduction model and thermo-mechanics parameters, the finite element procedure was applied to analyze the deformation of three spans pre-stressed concrete thin-walled multi-room box girders exposed to co-action of fire and load. In conclusion, the deflection is obvious under action of the variation width and fire load model.

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A parallel finite element procedure for contact-impact problems

Engineering With Computers ◽

10.1007/s00366-003-0252-4 ◽

2003 ◽

Vol 19 (2-3) ◽

pp. 67-84 ◽

Cited By ~ 10

Author(s):

Jason Har ◽

Robert E. Fulton

Keyword(s):

Finite Element ◽

Parallel Finite Element ◽

Finite Element Procedure ◽

Contact Impact ◽

Impact Problems

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A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

Journal of Electronic Packaging ◽

10.1115/1.2792281 ◽

1998 ◽

Vol 120 (1) ◽

pp. 24-34 ◽

Cited By ~ 25

Author(s):

C. Fu ◽

D. L. McDowell ◽

I. C. Ume

Keyword(s):

Finite Element ◽

Electronic Packaging ◽

Copper Interconnects ◽

Implicit Time ◽

Integration Scheme ◽

Single Element ◽

Ofhc Copper ◽

Computation Efficiency ◽

Backward Euler ◽

Finite Element Procedure

A finite element procedure using a semi-implicit time-integration scheme has been developed for a cyclic thermoviscoplastic constitutive model for Pb-Sn solder and OFHC copper, two common metallic constituents in electronic packaging applications. The scheme has been implemented in the commercial finite element (FE) code ABAQUS (1995) via the user-defined material subroutine, UMAT. Several single-element simulations are conducted to compare with previous test results, which include monotonic tensile tests, creep tests, and a two-step ratchetting test for 62Sn36Pb2Ag solder; a nonproportional axial-torsional test and a thermomechanical fatigue (TMF) test for OFHC copper. At the constitutive level, we also provide an adaptive time stepping algorithm, which can be used to improve the overall computation efficiency and accuracy especially in large-scale FE analyses. We also compare the computational efforts of fully backward Euler and the proposed methods. The implementation of the FE procedure provides a guideline to apply user-defined material constitutive relations in FE analyses and to perform more sophisticated thermomechanical simulations. Such work can facilitate enhanced understanding thermomechanical reliability issue of solder and copper interconnects in electronic packaging applications.

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Generalized Purpose Program of Heat Conduction and Stress Analysis of a Three Dimensional Axisymmetric Problem by Finite Element Method, and Application to the Stress Analysis of Piston

Transactions of the Japan Society of Mechanical Engineers ◽

10.1299/kikai1938.37.2082 ◽

1971 ◽

Vol 37 (303) ◽

pp. 2082-2092

Author(s):

Toshio TSUTA

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Heat Conduction ◽

Stress Analysis ◽

Axisymmetric Problem ◽

Three Dimensional ◽

Element Method

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Simultaneous Determination of Steady Temperatures and Heat Fluxes on Surfaces of Three Dimensional Objects Using FEM

10.1115/imece2001/htd-24310 ◽

2001 ◽

Author(s):

Brian H. Dennis ◽

George S. Dulikravich

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Heat Conduction ◽

Three Dimensional ◽

Heat Fluxes ◽

Multiply Connected ◽

Three Dimensional Objects ◽

Solid Objects ◽

System Solution

Abstract A finite element method (FEM) formulation is presented for the prediction of unknown steady boundary conditions in heat conduction on multiply connected three-dimensional solid objects. The present FEM formulation is capable of determining temperatures and heat fluxes on the boundaries where such quantities are unknown or inaccessible, provided such quantities are sufficiently over-specified on other boundaries. Details of the discretization, linear system solution techniques, regularization, and sample results for 3-D problems are presented.

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