Comments on the paper “On phase-lag Green–Naghdi theory without energy dissipation for electro-thermoelasticity including heat sources, Sayed I. El-Attar, Mohamed H. Hendy, Magdy A. Ezzat, Mechanics Based Design of Structures and Machines, 2019 47(6) 769–786”

Author(s):  
Asterios Pantokratoras
2016 ◽  
Vol 32 (6) ◽  
pp. 665-671 ◽  
Author(s):  
R. Kumar ◽  
S. Devi

AbstractThe main objective of the present paper is to analyze the effects of phase-lag on thick circular plate with heat sources in modified couple stress thermoelastic medium. The mathematical formulation is prepared for three-phase-lag heat conduction model subjected to prescribed normal heat flux along with stress free boundary. Laplace and Hankel transforms are used to deal the problem. The displacements, stresses and temperature change are obtained in the transformed domain. Numerical inversion technique has been used to obtain the solutions in the physical domain. The results obtained numerically for these quantities are presented graphically. Some particular cases are also discussed in the present problem.


Mathematics ◽  
2020 ◽  
Vol 8 (10) ◽  
pp. 1711
Author(s):  
Faris Alzahrani ◽  
Ibrahim Abbas

In this work, the new model of photothermal and elastic waves, with and without energy dissipation, under a hyperbolic two-temperature model, is used to compute the displacement, carrier density, thermodynamic temperature, conductive temperature and stress in a semiconductor medium. The medium is considered in the presence of the coupling of plasma and thermoelastic waves. To get the complete analytical expressions of the main physical fields, Laplace transforms and the eigenvalue scheme are used. The outcomes are presented graphically to display the differences between the classical two-temperature theory and the new hyperbolic two-temperature theory, with and without energy dissipation. Based on the numerical results, the hyperbolic two-temperature thermoelastic theory offers a finite speed of mechanical waves and propagation of thermal waves.


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