Coupled growth of Al-Al2Cu eutectics in Al-Cu-Ag alloys

Author(s):  
U Hecht ◽  
V Witusiewicz ◽  
A Drevermann
Keyword(s):  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Rafael Kakitani ◽  
Cassio Augusto Pinto da Silva ◽  
Bismarck Silva ◽  
Amauri Garcia ◽  
Noé Cheung ◽  
...  

Purpose Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients within the experimental spectrum. In these cases, associations only with the solidification velocity could give the false impression that reaching a given velocity would be enough to reproduce a result. However, that velocity must necessarily be accompanied by a specific thermal gradient during transient solidification. Therefore, the purpose of this paper is to not only project velocity but also include the gradients acting for each velocity. Design/methodology/approach Compilation of solidification velocity, v, thermal gradient, G, and cooling rate, Ṫ, data for Sn-Cu and Sn-Bi solder alloys of interest is presented. These data are placed in the form of coupled growth zones according to the correlated microstructures in the literature. In addition, results generated in this work for Sn-(0.5, 0.7, 2.0, 2.8)% Cu and Sn-(34, 52, 58)% Bi alloys solidified under non-stationary conditions are added. Findings When analyzing the cooling rate (Ṫ = G.v) and velocity separately, in or around the eutectic composition, a consensus cannot be reached on the resulting microstructure. The (v vs. G) + cooling rate diagrams allow comprehensive analyzes of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. Originality/value The present paper is devoted to the establishment of (v vs. G) + cooling rate diagrams. These plots may allow comprehensive analyses of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. This microstructure-processing mapping approach is promising to predict phase competition and resulting microstructures in soldering of Sn-Cu and Sn-Bi alloys. These two classes of alloys are of interest to the soldering industry, whereas manipulation of their microstructures is considered of utmost importance for the metallurgical quality of the product.


2001 ◽  
Author(s):  
B. Andrews ◽  
L. Hayes ◽  
S. Coriell
Keyword(s):  

2002 ◽  
Vol 66 (1) ◽  
pp. 9-15 ◽  
Author(s):  
Yoshiki Mizutani ◽  
Hideyuki Yasuda ◽  
Itsuo Ohnaka ◽  
Nobuhiro Maeda ◽  
Yoshiharu Waku

2020 ◽  
Vol 189 ◽  
pp. 11-15
Author(s):  
Samira Mohagheghi ◽  
Sabine Bottin-Rousseau ◽  
Silvère Akamatsu ◽  
Melis Şerefoğlu

2001 ◽  
Vol 222 (3) ◽  
pp. 645-654 ◽  
Author(s):  
Y.C. Liu ◽  
G.C. Yang ◽  
X.F. Guo ◽  
J. Huang ◽  
Y.H. Zhou

1996 ◽  
Author(s):  
J. Barry Andrews ◽  
Larry C. Hayes ◽  
Y. Arikawa ◽  
S. O'Dell ◽  
A. Cheney

1981 ◽  
Vol 9 ◽  
Author(s):  
A. Bergman ◽  
T. Carlberg ◽  
H. Fredriksson ◽  
J. Stjerndahl

ABSTRACTUnidirectional solidification experiments with monotectic and near monotectic Cu-Pb alloys have been performed with the growth direction both parallel and antiparallel to the gravity vector. It was found that a more regular composite structure was possible to achieve in the samples solidified parallel to the gravity vector. It was also found that the amount of lead rich phase, regularily incorporated in the structure, was less than one would expect theoretically. It is proposed that monotectic alloys can solidify to two different kinds of composite structures. One, which can be described by the theory of coupled growth of a rod eutecticum, and the other similar to the growth of primary rods.


1988 ◽  
Vol 19 (5) ◽  
pp. 1367-1369 ◽  
Author(s):  
Edward Fras ◽  
Hugo F. López ◽  
Adam Liszka
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document