A post-processing approach to minimize TSV number for high-level synthesis of 3D ICs

Author(s):  
Chih-Hung Lee ◽  
Tsorng-Yu Huang ◽  
Chun-Hua Cheng ◽  
Shih-Hsu Huang
Author(s):  
Akira OHCHI ◽  
Nozomu TOGAWA ◽  
Masao YANAGISAWA ◽  
Tatsuo OHTSUKI

2019 ◽  
Vol 12 (2) ◽  
pp. 1-26 ◽  
Author(s):  
Julian Oppermann ◽  
Melanie Reuter-Oppermann ◽  
Lukas Sommer ◽  
Andreas Koch ◽  
Oliver Sinnen

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