A post-processing approach to minimize TSV number for high-level synthesis of 3D ICs
2009 ◽
Vol E92-A
(12)
◽
pp. 3169-3179
◽
2017 ◽
Vol E100.A
(7)
◽
pp. 1439-1451
Keyword(s):
2014 ◽
Vol E97.A
(12)
◽
pp. 2498-2506
Keyword(s):
1996 ◽
2019 ◽
Vol 12
(2)
◽
pp. 1-26
◽
Keyword(s):