MEMS atomic vapor cells sealed by Cu-Cu thermocompression bonding

Author(s):  
Sylvain Karlen ◽  
Jacques Haesler ◽  
Thomas Overstolz ◽  
Giovanni Bergonzi ◽  
Steve Lecomte
2020 ◽  
Vol 29 (1) ◽  
pp. 95-99
Author(s):  
Sylvain Karlen ◽  
Jacques Haesler ◽  
Thomas Overstolz ◽  
Giovanni Bergonzi ◽  
Steve Lecomte

2020 ◽  
Vol 29 (1) ◽  
pp. 25-35 ◽  
Author(s):  
Radwan M. Noor ◽  
Mohammad H. Asadian ◽  
Andrei M. Shkel

Author(s):  
Zhang Chang ◽  
Zhang Shuangyou ◽  
Guo Dengzhu ◽  
Wang Zhong ◽  
Zhao Jianye

2003 ◽  
Vol 74 (6) ◽  
pp. 3142-3145 ◽  
Author(s):  
S. Knappe ◽  
V. Velichansky ◽  
H. G. Robinson ◽  
J. Kitching ◽  
L. Hollberg

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