High-Temperature Heat Flux Sensor Based on Tungsten–Rhenium Thin-Film Thermocouple

2020 ◽  
Vol 20 (18) ◽  
pp. 10444-10452
Author(s):  
Xiaoli Fu ◽  
Qiyu Lin ◽  
Yongqing Peng ◽  
Jianhua Liu ◽  
Xiaofei Yang ◽  
...  
Author(s):  
Sujay Raphael-Mabel ◽  
Scott Huxtable ◽  
Andrew Gifford ◽  
Thomas E. Diller

A new type of heat flux sensor (HTHFS) has been designed and constructed for applications at high temperature and high heat flux. It is constructed by connecting solid metal plates to form brass/steel thermocouple junctions in a series circuit. The thermal resistance layer of the HTHFS consists of the thermocouple materials themselves, thus improving temperature limits and lowering the temperature disruption of the sensor. The sensor can even withstand considerable erosion of the surface with little effect on the operation. A new type of convection calibration apparatus was designed and built specifically to supply a large convection heat flux. The heat flux was supplied simultaneously to both a test and standard gage by using two heated jets of air that impinged perpendicularly on the surface of each gage. The sensitivity for the HTHFS was measured to have an average value of 20 μV/(W/cm2). The uncertainty in this result was determined to be ±10% over the entire range tested. The sensitivity agrees with the theoretically calculated sensitivity for the materials and geometry used. Recommendations for future improvements in the construction and use of the sensors are discussed.


2020 ◽  
Vol 2020 (0) ◽  
pp. J05229
Author(s):  
Shohei SHIMODA ◽  
Osamu NAKABEPPU ◽  
Makoto KAMATA ◽  
Daichi KATANO

2018 ◽  
Vol 2018 (0) ◽  
pp. 0070
Author(s):  
Daiki Matsugi ◽  
Tsuneyoshi Matsuoka ◽  
Yuji Nakamura ◽  
Ken Matsuyama

2014 ◽  
Vol 960-961 ◽  
pp. 304-307
Author(s):  
Shuo Wu ◽  
Fang Ye ◽  
Hang Guo ◽  
Chong Fang Ma

A Cu-Ni thin film heat flux sensor had been fabricated on a 0.05mm thick polyimide film substrate by vacuum coating technology. The overall dimension of the sensor was 8 mm long and 4 mm wide. A thermopile and a thermocouple were arranged on the substrate to measure both heat flux and surface temperature. The thermopile had 18 thermocouple junctions which formed 9 pairs of differential thermocouples and were covered by two different thickness of thermal resistance layers. This research carried out static and dynamic tests of the thin film heat flux sensor. Seebeck coefficient of thermocouple is 19.3761μV/(°C). Sensitivity of the thermopile is 0.010121μV/(W/m2). Steady-state tests of the thermopile and the thermocouple were taken separately. Time constant of the thermocouple is about 0.26s, which is faster than the thermopile of 1.57s.


Author(s):  
Houssein Ammar ◽  
David Hamadi ◽  
Bertrand Garnier ◽  
Ahmed Ould El Moctar ◽  
Hassan Peerhossaini ◽  
...  

Heat-transfer analysis in microfluidic devices is of great importance in applications such as micro-heat exchangers and microreactors. This work reports on improvements in temperature measurement techniques, which can be the source of large errors due to their intrusiveness and the unreliability of conventional thermal sensors. Gold thin films were deposited on a borosilicate substrate to realize a 2D heat flux sensor for heat-transfer measurement along the main flow within microchannels. Two applications are shown, one related to micro-heat exchangers and the other to microreactors. For the micro-heat exchanger, the effect of length scale on heat transfer in a straight microchannel was investigated and the validity of macroscale correlations for convective heat transfer was checked for deionized water flowing in microchannels of heights 12 to 52 μm. For the microreactor, the reaction enthalpy of an acid–base reaction measured using the new heat-flux sensor had only a 5% discrepancy from the standard value, showing the efficiency of the new thin-film device.


2013 ◽  
Vol 378 ◽  
pp. 302-307 ◽  
Author(s):  
B. Azerou ◽  
B. Garnier ◽  
A. Lahmar

The measurement of thermal properties or internal or external boundary conditions requires temperature and heat flux data. Both information can be provided by heat flux sensors. The one consisting in measuring temperature at various locations within the wall and using inverse method to estimate wall temperature and heat flux is among those providing the lowest measurement bias for transient heat flux measurement. However, this very accurate sensor requires time consuming technical work for microthermocouples implementation and due to the welding, one cannot locate precisely the temperature measurement. The idea developed in this work is to replace the wire microthermocouples by thin film resistance temperature detectors deposited on polymer substrate in order to ease the fabrication and to increase the accuracy of heat flux sensor. As the deposited sensors are RTDs, a preliminary study is performed showing the effect of the metal as well as the processing conditions on the electrical resistivity and temperature coefficient of copper and aluminum thin film


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