Fabrication Of Multiple Wavelength Vertical-cavity Surface-emitting Laser Array Using Flip-chip Bonding

2005 ◽  
Author(s):  
I. Ogura ◽  
M. Kajita ◽  
S. Kawai ◽  
K. Kasahara
Keyword(s):  
Flip Chip ◽  
Cavity Surface ◽  
Laser Array ◽  
Flip Chip Bonding ◽  
Multiple Wavelength ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity

Flip-chip bonded 0.85-um Vertical-cavity Surface-emitting Laser Array using an AlGaAs substrate

1996 ◽  
Author(s):  
Yoshitaka Ohiso ◽  
Kouta Tateno ◽  
Yoshitaka Kohama ◽  
Hideki Tsunetsugu ◽  
Takashi Kurokawa
Keyword(s):  
Flip Chip ◽  
Cavity Surface ◽  
Laser Array ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity

1.2 µm Band GaInAs/GaAs High-Density Multiple-Wavelength Vertical Cavity Surface Emitting Laser Array

2005 ◽  
Vol 44 (No. 6) ◽  
pp. L214-L215 ◽  
Author(s):  
Yasuhiro Uchiyama ◽  
Takashi Kondo ◽  
Kazutaka Takeda ◽  
Akihiro Matsutani ◽  
Takeshi Uchida ◽  
...  
Keyword(s):  
High Density ◽  
Cavity Surface ◽  
Laser Array ◽  
Multiple Wavelength ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity
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