Metallized Blind Via Holes and Surface Etching Incorporation for Miniaturization Enhancement in Slow-wave Substrate Integrated Waveguide
2018 ◽
Vol 66
(6)
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pp. 3019-3027
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Keyword(s):
2020 ◽
Vol 30
(8)
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pp. 753-756
2020 ◽
Vol 14
(10)
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pp. 1096-1107
Keyword(s):
2019 ◽
Vol 30
(2)
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2018 ◽
Vol 66
(7)
◽
pp. 3747-3751
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Keyword(s):