Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates

Author(s):  
Omer F. Yildiz ◽  
Ole Thomsen ◽  
Marc Bochard ◽  
Cheng Yang ◽  
Christian Schuster
2017 ◽  
Vol 11 (14) ◽  
pp. 2010-2015 ◽  
Author(s):  
Dirk Godlinski ◽  
Ralf Zichner ◽  
Volker Zöllmer ◽  
Reinhard R. Baumann

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