IEEE Transactions on Components Packaging and Manufacturing Technology
Latest Publications

TOTAL DOCUMENTS

3527

(FIVE YEARS 1021)

H-INDEX

(FIVE YEARS 8)

Published By Institute Of Electrical And Electronics Engineers

2156-3985, 2156-3950

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of 3D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2022.3140863 ◽

2022 ◽

pp. 1-1

Author(s):

Zuohuan Chen ◽

Daquan Yu

Keyword(s):

Wafer Level ◽

Thin Glass ◽

Wafer Level Packaging

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A Wettability-mediated Microdroplet under Electrowetting Effect for Hotspot Cooling

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2022.3143687 ◽

2022 ◽

pp. 1-1

Author(s):

Israr Ahmad ◽

Atul Ranjan ◽

Manabendra Pathak ◽

Mohd Kaleem Khan

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Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2022.3143507 ◽

2022 ◽

pp. 1-1

Author(s):

Joao V. T. Silveira ◽

Zidi Li ◽

Kazuyoshi Fushinobu ◽

Ryuta Yasui ◽

Takuya Shinoda

Keyword(s):

Heat Generation ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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Modeling and Analysis of Signal Integrity of Ball Grid Array Packages with Failed Ground Solder Balls

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2022.3143110 ◽

2022 ◽

pp. 1-1

Author(s):

Kaixuan Song ◽

Jinchun Gao ◽

George T. Flowers ◽

Ziren Wang ◽

Wei Yi ◽

...

Keyword(s):

Signal Integrity ◽

Ball Grid Array ◽

Modeling And Analysis ◽

Solder Balls ◽

Ball Grid Array Packages

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Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2022.3140920 ◽

2022 ◽

pp. 1-1

Author(s):

Michael Wulff ◽

Til Hillebrecht ◽

Lei Wang ◽

Cheng Yang ◽

Christian Schuster

Keyword(s):

Angular Momentum ◽

Orbital Angular Momentum ◽

Transmission Lines ◽

Multiconductor Transmission Lines ◽

Communication Links

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IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3130775 ◽

2021 ◽

Vol 11 (12) ◽

pp. 2041-2042

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IEEE Components, Packaging, and Manufacturing Technology Society information for authors

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3130777 ◽

2021 ◽

Vol 11 (12) ◽

pp. C3-C3

Keyword(s):

Manufacturing Technology

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2021 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3135745 ◽

2021 ◽

Vol 11 (12) ◽

pp. 2246-2296

Keyword(s):

Manufacturing Technology

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Front Cover

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3130771 ◽

2021 ◽

Vol 11 (12) ◽

pp. C1-C1

Keyword(s):

Front Cover

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IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3130773 ◽

2021 ◽

Vol 11 (12) ◽

pp. C2-C2

Keyword(s):

Manufacturing Technology

Download Full-text

IEEE Transactions on Components Packaging and Manufacturing Technology
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Institute Of Electrical And Electronics Engineers

Development of 3D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

A Wettability-mediated Microdroplet under Electrowetting Effect for Hotspot Cooling

Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards

Modeling and Analysis of Signal Integrity of Ball Grid Array Packages with Failed Ground Solder Balls

Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links

Table of Contents

IEEE Components, Packaging, and Manufacturing Technology Society information for authors

2021 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11

Front Cover

IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Export Citation Format

IEEE Transactions on Components Packaging and Manufacturing TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Institute Of Electrical And Electronics Engineers

Development of 3D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

A Wettability-mediated Microdroplet under Electrowetting Effect for Hotspot Cooling

Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards

Modeling and Analysis of Signal Integrity of Ball Grid Array Packages with Failed Ground Solder Balls

Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links

Table of Contents

IEEE Components, Packaging, and Manufacturing Technology Society information for authors

2021 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11

Front Cover

IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

IEEE Transactions on Components Packaging and Manufacturing Technology
Latest Publications