Methods for water resistance testing of sun protection products

1979 ◽  
Vol 1 (3) ◽  
pp. 147-157 ◽  
Author(s):  
F. GREITER ◽  
P. BILEK ◽  
S. DOSKOCZIL ◽  
J. WASHÜTTL ◽  
F. WURST
2020 ◽  
Vol 8 (2) ◽  
pp. 17-24
Author(s):  
Ahmad Al Ghozali Hasan ◽  
Amrul Amrul ◽  
M Irsyad

Torefaction is one method of utilizing biomass waste into fuel through a thermal process that takesplace at atmospheric pressure with a temperature range of 200-350 ℃ to a solid quality fuelequivalent to sub-bituminous coal. Densification aims to increase biomass mass density. Thecombination of densification and torrefaction is an attractive process option to get high qualitybriquette and pellet fuel. Making briquettes with the hot printing method is able to eliminate theadhesive material so that the process of making briquettes is faster, direct briquettes can be usedwithout a drying process and are able to maintain the calorific value of raw materials. The purposeof this study is to examine the effect of suppression and heating on the briquetting process oftorefaction results on the quality of briquettes based on the physical properties of the drop test,water resistance, combustion temperature and length of combustion. The best quality briquettesfound were 8 tons of briquettes with a temperature of 150 ℃, where the briquette drop test did notlose much material. In water resistance testing, the water absorbed in 8 ton briquettes withtemperature of 150 ℃ is quite low, and when testing the combustion of briquettes is also quite good.Keywords : Torefaction, densification, briquettes, drop test, water resistant, combustion


2019 ◽  
Vol 2019 (1) ◽  
pp. 000423-000427
Author(s):  
S. Kummerl ◽  
D. Mantle ◽  
N. Patel ◽  
R. Munje ◽  
P. Chen

Abstract This paper explores the “IEC standard 60529 International Protection Marking” also sometimes referenced as Ingress Protection Marking and how it applies to mobile and wearable electronics on a component level. The testing methodology used for an OCQFN (Open Cavity Quad Flatpack No-lead) humidity sensor will be evaluated including pass/fail criteria. The applicability of this standard has been developed to verify the robustness of finished mechanical assemblies intended to be put in static mounted applications but in this case has been adopted to verify the robustness of a semiconductor based sensor at a packaging level with accelerated pre-conditioning to predict the end of life performance.


Author(s):  
Joseph V. Koleske ◽  
John Fletcher ◽  
Joseph Walker

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