scholarly journals Application of Digital Image Correlation to Address Complex Motions in Thermoelastic Stress Analysis

Strain ◽  
2015 ◽  
Vol 51 (5) ◽  
pp. 405-418 ◽  
Author(s):  
W. Wang ◽  
R. K. Fruehmann ◽  
J. M. Dulieu-Barton
Keyword(s):  
Digital Image Correlation ◽  
Stress Analysis ◽  
Digital Image ◽  
Thermoelastic Stress ◽  
Image Correlation ◽  
Thermoelastic Stress Analysis

Combined thermoelastic stress analysis and digital image correlation with a single infrared camera

2011 ◽  
Vol 46 (8) ◽  
pp. 783-793 ◽  
Author(s):  
M L Silva ◽  
G Ravichandran
Keyword(s):  
Digital Image Correlation ◽  
Stress Analysis ◽  
Digital Image ◽  
Thermoelastic Stress ◽  
Infrared Camera ◽  
Image Correlation ◽  
Measured Temperature ◽  
Thermoelastic Stress Analysis ◽  
Alloy Plate ◽  
Full Field

A novel methodology simultaneously combining thermoelastic stress analysis (TSA) and digital image correlation (DIC) with a single infrared camera is presented. DIC is an optical method to determine deformation by image tracking with strains determined via differentiation. TSA is a non-contact measurement technique that provides the full-field stress directly using measured temperature changes. The combination of the two techniques improves the resolution and accuracy of TSA results by correcting for sample motion and distortion during loading. Illustrative examples, including an aluminium alloy plate with an edge crack and a nylon plate with a hole under tension, demonstrate the combined method which simultaneously measures stress and displacement.

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