Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments

1991 ◽  
Author(s):  
Gerd Guelker ◽  
Olaf Haack ◽  
Klaus D. Hinsch ◽  
Claudia Hoelscher ◽  
Juergen Kuls ◽  
...  
1997 ◽  
Author(s):  
Rini Widiastuti ◽  
Sanichiro J. Yoshida ◽  
Suprapedi ◽  
A. Kusnowo ◽  
M. H. br Pardede ◽  
...  

2006 ◽  
Vol 326-328 ◽  
pp. 95-98 ◽  
Author(s):  
Tomohisa Shiraishi ◽  
Satoru Toyooka ◽  
Hirofumi Kadono ◽  
Takayuki Saito ◽  
Sun Ping

In Dynamic Electronic Speckle Pattern Interferometry (DESPI), deformation analysis could be done for successively acquired frame data of interfering speckle patterns with no additional frames like phase shifting speckle patterns. Our final goal is to obtain a temporally varying process of two-dimensional strain field. Two normal strains and shearing strain are derived by numerical derivatives of two components of in-plane deformation. Analyzed results of tensile experiments of an Al-alloy sample will be shown. In the experiments, propagation of a strain localization band accompanied by serration of a stress curve was clearly observed quantitatively analyzed.


Sign in / Sign up

Export Citation Format

Share Document