Acoustic imaging of string instrument soundboxes

2013 ◽  
Vol 133 (5) ◽  
pp. 3233-3233
Author(s):  
Chris Waltham ◽  
Evert Koster ◽  
Nils Smit-Anseeuw ◽  
Aaron Zimmer
Keyword(s):  
Acoustic Imaging ◽  
String Instrument

scholarly journals Acoustic imaging of string instrument soundboxes

2013 ◽  
Author(s):  
Christopher Waltham ◽  
Evert Koster ◽  
Nils Smit-Anseeuw ◽  
Aaron Zimmer
Keyword(s):  
Acoustic Imaging ◽  
String Instrument

Dipole Shear Imaging behind casing: Extending the borehole Acoustic Imaging envelope to Brown-fields

2014 ◽  
Author(s):  
Ashok Srivastava ◽  
Hiroaki Yamamoto ◽  
Shabbir Ahmed ◽  
Jonathon Roberts ◽  
Fabrice Cantin ◽  
...  
Keyword(s):  
Acoustic Imaging

Borehole Acoustic Imaging Using 3D STC and Ray Tracing to Determine Far-Field Reflector Dip and Azimuth

2019 ◽  
Vol 60 (2) ◽  
pp. 335-347 ◽  
Author(s):  
Nicholas Bennett ◽  
◽  
Adam Donald ◽  
Sherif Ghadiry ◽  
Mohamed Nassar ◽  
...  
Keyword(s):  
Ray Tracing ◽  
Acoustic Imaging ◽  
Far Field

Electronic Package Failure Analysis Using TDR

2000 ◽  
Author(s):  
Dima A. Smolyansky
Keyword(s):  
Failure Analysis ◽  
Fault Location ◽  
Measurement Accuracy ◽  
Time Domain Reflectometry ◽  
Acoustic Imaging ◽  
X Ray ◽  
Analysis Techniques ◽  
Bga Packages ◽  
Impedance Profile ◽  
Nature Of Time

Abstract The visual nature of Time Domain Reflectometry (TDR) makes it a very natural technology that can assist with fault location in BGA packages, which typically have complex interweaving layouts that make standard failure analysis techniques, such as acoustic imaging and X-ray, less effective and more difficult to utilize. This article discusses the use of TDR for package failure analysis work. It analyzes in detail the TDR impedance deconvolution algorithm as applicable to electronic packaging fault location work, focusing on the opportunities that impedance deconvolution and the resulting true impedance profile opens up for such work. The article examines the TDR measurement accuracy and the comparative package failure analysis, and presents three main considerations for package failure analysis. It also touches upon the goal and the task of the failure analysts and TDR's specific signatures for the open and short connections.

Directional P-wave Remote Acoustic Imaging in An Acoustically Slow Formation

2015 ◽  
Vol 8 (1) ◽  
Author(s):  
Hua Wang ◽  
Zhoutuo Wei ◽  
Xiaoming Tang ◽  
Chunxi Zhuan
Keyword(s):  
Acoustic Imaging ◽  
P Wave
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